Defect injection structure and mechanism for magnetic memory

ABSTRACT

The various implementations described herein include magnetic memory devices and systems, and methods for injecting defects into the devices and systems. In one aspect, a magnetic memory device comprises a non-magnetic cylindrical core, a first portion, and a second portion. The core is configured to receive a current. The first portion surrounds the core and is configured to introduce magnetic instabilities into the second portion. The second portion is adjacent to and arranged in a stack with respect to the first portion. The second portion also surrounds the core and is configured to store information based on a respective position of the magnetic instabilities. The second portion comprises a first plurality of magnetic layers and a first plurality of non-magnetic layers. Respective magnetic layers of the first plurality of magnetic layers are separated by respective non-magnetic layers of the plurality of non-magnetic layers.

RELATED APPLICATIONS

This application is related to U.S. Utility patent application Ser. No.16/147,283, entitled “Defect Propagation Structure and Mechanism forMagnetic Memory,” filed Sep. 28, 2018, which is incorporated byreference herein in its entirety.

TECHNICAL FIELD

This relates generally to the field of memory applications, includingbut not limited to magnetic memory.

BACKGROUND

Magnetoresistive random access memory (MRAM) is a non-volatile memorytechnology that stores data through magnetic storage elements. MRAMdevices store information by changing the orientation of themagnetization of a storage layer. For example, based on whether thestorage layer is in a parallel or anti-parallel alignment relative to areference layer, either a “1” or a “0” can be stored in each MRAM cell.

The field of memory applications is becoming more challenging as theperformance requirements for memory-based devices increase. Because ofmany useful properties of MRAM (e.g., retention of data, resistance toerrors, and life span of memory cells), memory systems based on MRAMhave superior performance over conventional memory systems.

SUMMARY

There is a need for systems and/or devices with more efficient,accurate, and effective methods for fabricating and/or operating memorysystems. Such systems, devices, and methods optionally complement orreplace conventional systems, devices, and methods for fabricatingand/or operating memory systems.

The present disclosure describes various implementations of MRAM systemsand devices. As discussed in greater detail below, MRAM stores datathrough magnetic storage elements. These elements typically include twoferromagnetic films or layers that can hold a remanent magnetization andare separated by a non-magnetic material. In general, one of the layershas its magnetization pinned (e.g., a “reference layer”), meaning thatthis layer possesses a large thermal stability and requires a largemagnetic field or spin-polarized current to change the orientation ofits magnetization. The second layer is typically referred to as thestorage, or free, layer and its magnetization direction can be changedby a smaller magnetic field or spin-polarized current relative to thereference layer.

Due to the spin-polarized electron tunneling effect, the electricalresistance of the cell changes due to the relative orientation of themagnetization of the two layers. A memory cell's resistance will bedifferent for the parallel and anti-parallel states and thus the cell'sresistance can be used to distinguish between a “1” and a “0”. Oneimportant feature of MRAM devices is that they are non-volatile memorydevices, since they maintain the information even when the power is off.In particular, the layers can be a few nanometers in lateral size andthe magnetization direction can still be stable over time and withrespect to thermal fluctuations.

The present disclosure also describes various implementations ofthree-dimensional (3D) MRAM systems and devices that generate and movedata within the device (e.g., along a length of the device), analogousto a shift register (e.g., ratchets). In these 3D MRAM systems anddevices, the data is stored in the form of magnetic bits within themagnetic layers of the systems and devices. The non-volatility of themagnetic layers makes them ideal candidates for implementing logicoperations. Furthermore, because the MRAM devices are situated above thetwo-dimensional wafer space, the effective areal density of the devicecan be multiplied by increasing the number of magnetic layers in thedevice.

In accordance with some implementations, the 3D MRAM systems and devicesare cylindrically shaped with an electrically conductive (andnon-magnetic) cylindrical core and annular magnetic layers as storageelements. These magnetic layers are annularly shaped and includeferromagnetic materials (e.g., films) that can hold a remanentmagnetization. A typically configuration includes two or more magneticlayers, with every two adjacent magnetic layers separated by anon-magnetic layer (e.g., material). In accordance with someimplementations, a variant that utilizes Spin Hall Effect may be used toswitch layers in the vortex magnetization configuration. Data can alsobe injected and propagated synchronously across several of the magneticmultilayers.

The present disclosure also describes various implementations of areadout component that reads out the state of the magnetic shiftregister (e.g., ratchet). In some implementations, the readout componentcomprises a concentric (e.g., annular, ring-shaped) magnetic tunneljunction (MTJ), for example a concentric inner magneticmetal/insulator/outer magnetic metal structure in which the outermagnetic metal comprises a ferromagnetic (e.g., Fe) layer which isrelatively thick compared to the respective magnetic layers in theratchet. The outer ferromagnetic layer has a vortex magnetic groundstate with a fixed magnetization direction. In some implementations, theinsulator portion comprises a dielectric such as MgO. In someimplementations, the readout component would essentially wrap round thetop part of the ratchet potentially encompassing several of its activelayers. By passing current radially through the device, the tunnelingcurrent would depend on the relative alignment of the magnetization ofthe layers in the ratchet and the magnetization in the outer layer ofthe device, thereby enabling a readout of the magnetic state of theunderlying layers in the ratchet.

In one aspect, some implementations include a magnetic memory devicecomprising (i) a non-magnetic cylindrical core configured to receive acurrent, (ii) a plurality of magnetic layers surrounding the cylindricalcore, and (iii) a plurality of non-magnetic layers also surrounding thecylindrical core. Each of the plurality of non-magnetic layers and eachof the plurality of magnetic layers shares a common surface with thecore. The plurality of magnetic layers and the plurality of non-magneticlayers are arranged in a stack coaxial with the cylindrical core (e.g.,the layers are coaxial and concentric with respect to the core), andrespective magnetic layers of the plurality of magnetic layers areseparated by respective non-magnetic layers of the plurality ofnon-magnetic layers. In other words, respective non-magnetic layers areinterspersed between the plurality of magnetic layers such that arespective non-magnetic layer is sandwiched between two magnetic layers(e.g., respective magnetic layers alternate with respective non-magneticlayers in the stack). In some implementations each and every one of thelayers is cylindrical (e.g., annular) in shape. The magnetic memorydevice also comprises (iv) an input terminal coupled to a first end ofthe cylindrical core and a (v) current source, coupled to the inputterminal, that is configured to supply current imparting a Spin HallEffect (SHE) around the circumference (e.g., perimeter, a surface of thecylindrical core and/or a surface of the cylindrical core that iscoaxial with the cylindrical core) of the cylindrical core. The SHEcontributes to a magnetization of the plurality of magnetic layers. Insome implementations, each of the plurality of magnetic layers has arespective magnetization, and the SHE imparted around the circumferenceof the core contributes to a magnetization of each of the plurality ofmagnetic layers.

In another aspect, some implementations include a method of propagatinginformation in a magnetic memory (e.g., information stored in the formof magnetic bits). The method is performed at a magnetic memory devicethat includes a cylindrical core, a plurality of magnetic layerssurrounding the cylindrical core, and a plurality of non-magnetic layersalso surrounding the cylindrical core (e.g., each of the plurality ofnon-magnetic layers and each of the plurality of magnetic layers sharesa common surface with the core) and arranged in a stack coaxial with thecylindrical core, wherein respective magnetic layers of the plurality ofmagnetic layers are separated by respective non-magnetic layers of theplurality of non-magnetic layers, and the plurality of magnetic layersis arranged in an antiferromagnetic configuration except for a firstpair of adjacent magnetic layers of the plurality of magnetic layershaving magnetization in a first direction. The method includes supplyinga sequence of currents to an input terminal at a first end of thecylindrical core, the sequence of currents including a first current anda second current, wherein (i) the first current causes a first member inthe first pair of adjacent magnetic layers to switch from the firstdirection to a second direction opposite to the first direction, therebyresulting in a second pair of adjacent magnetic layers of the pluralityof magnetic layers having magnetization in the second direction, thesecond pair includes the first member of the first pair; and (ii) thesecond current causes a first member in the second pair of adjacentmagnetic layers to switch from the second direction to the firstdirection, thereby resulting in a third pair of adjacent magnetic layersof the plurality of magnetic layers having magnetization in the firstdirection. The third pair includes the first member of the second pair,and wherein the first member of the first pair is distinct from thefirst member of the second pair. In some implementations, each and everyone of the layers is cylindrical (e.g., annular). The layers are coaxialand concentric with respect to the core. In some implementations, thestack comprising the plurality of magnetic layers and the plurality ofnon-magnetic layers is known as a propagation layer (or a propagationstack/structure/portion) of the magnetic memory device. In someimplementations, the first pair of adjacent magnetic layers is alsoknown (e.g., referred to) as a magnetic instability and/or a defect inthe device. In some implementations, the first current and the secondcurrent are part of a current pulse having a leading edge and a trailingedge. The first current corresponds to the peak of the leading edge andthe second current corresponds to a predefined value at the trailingedge.

In yet another aspect, some implementations include a magnetic memorydevice comprising (i) a non-magnetic core configured to receive acurrent (e.g., and electrically conductive) cylindrical; (ii) a firstportion surrounding the cylindrical core, the first portion configuredto introduce (e.g., inject) one or more magnetic instabilities into asecond portion that is adjacent (e.g., contiguous, having a commonsurface) to the first portion and arranged in a stack with respect tothe first portion; and (iii) the second portion also surrounding thecylindrical core and configured to store information based on arespective position of the one or more defects, wherein: the secondportion comprises a first plurality of magnetic layers and a firstplurality of non-magnetic layers; and respective magnetic layers of thefirst plurality of magnetic layers are separated by respectivenon-magnetic layers of the plurality of non-magnetic layers. In someimplementations, the first portion is also known as the injector layerand the second portion is also known as the propagation layer (or apropagation stack/structure/portion). Each of the one or more magneticinstabilities is associated with two adjacent magnetic layers having asame magnetization direction (or the same magnetization polarity). Thesecond portion is an antiferromagnetically configured structure exceptfor the one or more magnetic instabilities. In some implementations,each of the magnetic stabilities is referred to as a defect. In someimplementations, the magnetization direction is a vortex magnetizationdirection. In the magnetic memory device, information is stored in theform of magnetic bits. Magnetic bits can take a ‘0’ or ‘1’ statedepending on the magnetization direction of adjacent magnetic layers. Insome implementations, the second portion (e.g., the propagation layer)is also referred to as a ratchet structure as it allows the magneticinstability (e.g., defect) to propagate in only one direction (e.g.,unidirectional).

In yet another aspect, some implementations include a method ofoperating a magnetic memory performed at a magnetic memory device thatcomprises a cylindrical core; a first portion surrounding thecylindrical core, the first portion including a first magnetic layerhaving a first magnetization in a first direction; and a second portionadjacent to the first portion and arranged in a stack with respect tothe first portion (e.g., the second portion is coaxial with thecylindrical core), wherein: the second portion includes a plurality ofmagnetic layers and a plurality of non-magnetic layers; the plurality ofmagnetic layers includes a second magnetic layer that is separated fromthe first magnetic layer by a non-magnetic layer; the plurality ofmagnetic layers includes a first subset having the first magnetizationin the first direction and a second subset having a second magnetizationin a second direction opposite to the first direction; and respectivemagnetic layers of the plurality of magnetic layers are separated byrespective non-magnetic layers of the plurality of non-magnetic layers.The method includes: supplying a sequence of currents coupled to aninput terminal at a first end of the cylindrical core, the sequence ofcurrents including a first current and a second current after the firstcurrent. The first current causes switching (e.g., a change) ofmagnetization direction of the second subset from the secondmagnetization in the second direction to the first magnetization in thefirst direction. The second current causes switching of magnetizationdirection of respective layers of the plurality of magnetic layers suchthat the second portion has an antiferromagnetic configuration with thesecond magnetic layer having the first magnetization in the firstdirection. In some implementations, the first portion is also known asan injector/injection portion (or an injection layer). In someimplementations, the first portion includes a single magnetic layer andthus the first magnetic layer is the single magnetic layer. In someimplementations, the first portion includes a plurality of magneticlayers and the first magnetic layer is the magnetic layer that isclosest to a magnetic layer of the second portion. In someimplementations, the second magnetic layer is the magnetic layer in thesecond portion that is closest to the first magnetic layer. In someimplementations, the first portion and the second portion each has acylindrical (e.g., annular) shape. In some implementations, the firstmagnetization and the second magnetization are vortex magnetizationshaving opposite directions (e.g., a clockwise direction and acounterclockwise direction, or vice versa). In some implementations, thefirst current causes each of the plurality of magnetic layers to havethe first magnetization direction. Thus, the first current causes boththe first magnetic layer and the second magnetic layer to havemagnetization in the first direction. Thus, an initial magneticinstability (e.g., an initial defect) is created at the first magneticlayer and the second magnetic layer which are adjacent to each other.This operation should not impact magnetization of the first portion.

Thus, devices and systems are provided with methods creating,propagating (e.g., moving) and reading out magnetic bits in magneticmemory, thereby increasing the effectiveness, efficiency, and usersatisfaction with such systems and devices.

BRIEF DESCRIPTION OF THE DRAWINGS

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawing(s) will be provided by the Office upon request and paymentof the necessary fee.

For a better understanding of the various described implementations,reference should be made to the Description of Implementations below, inconjunction with the following drawings in which like reference numeralsrefer to corresponding parts throughout the figures.

FIG. 1A illustrates a schematic diagram of a representative magnetictunnel junction (MTJ) structure in accordance with some implementations.

FIG. 1B illustrates representative energy barriers of the reference andstorage layers of the MTJ of FIG. 1A in accordance with someimplementations.

FIGS. 2A and 2B illustrate magnetization orientations in arepresentative perpendicular magnetic tunnel junction (pMTJ) structurein accordance with some implementations.

FIGS. 3A to 3D illustrate representative processes for switching thepMTJ of FIGS. 2A-2B between the parallel and anti-parallelconfigurations in accordance with some implementations.

FIG. 4 is a schematic diagram of a representative spin transfer torque(STT) MRAM device in accordance with some implementations.

FIG. 5 illustrates an exemplary three-dimensional MRAM system forimplementing a unidirectional vertical shift register betweenperpendicularly magnetized ferromagnets, in accordance with someimplementations.

FIG. 6 illustrates another exemplary three-dimensional MRAM device inaccordance with some implementations.

FIGS. 7A to 7C illustrate possible magnetic ground states (ormagnetizations) for a magnetic layer 604 of a cylindrical MRAMstructure, in accordance with some implementations.

FIGS. 8A and 8B are phase diagrams showing the relationship betweendimensions of a cylindrical MRAM device and the various magnetic groundstates (e.g., perpendicular, in-plane, and vortex magnetic groundstates) for permalloy and iron ferromagnetic layers, in accordance withsome implementations.

FIGS. 9A and 9B illustrate various energy barrier diagrams for thecylindrical MTJ structure in accordance with some implementations.

FIGS. 10A and 10B illustrate energy barriers of the cylindrical MTJstructure based on magnetization orientations in accordance with someimplementations.

FIG. 11 provides representative energy barrier equations for variousmagnetization orientations in accordance with some implementations.

FIG. 12 illustrates a readout component for a MRAM device, in accordancewith some implementations.

FIGS. 13A to 13J illustrate propagation of a magnetic instability in anMRAM system, in accordance with some implementations.

FIGS. 14A to 14D illustrate two magnetic ground states of an MRAMstructure and a numerical example of the process for shifting magneticbits in the MRAM system, in accordance with some implementations.

FIGS. 15A to 15D illustrates application of a current to a MRAM device,in accordance with some implementations.

FIG. 16 illustrates a cross-sectional view of an MRAM device andrelevant parameters, in accordance with some implementations.

FIG. 17 illustrates a resistivity model for an MRAM device, inaccordance with some implementations.

FIG. 18 illustrates estimations of thermal stability and switchingcurrents for a 20 nm-wide MRAM device, in accordance with someimplementations.

FIG. 19 illustrates corresponding effective fields (in Tesla) for the 20nm-wide MRAM device of FIG. 18, in accordance with some implementations.

FIGS. 20A and 20B illustrate values of RKKY coupling and Spin HallEffect (SHE) angle and resistivity from the prior art, in accordancewith some implementations.

FIG. 21 illustrates other values of RKKY coupling and Spin Hall Effect(SHE) angle and resistivity from prior art, in accordance with someimplementations.

FIG. 22A to 22F illustrate injection and propagation of defects in aMRAM system, in accordance with some implementations.

FIGS. 23A and 23B illustrate injection and propagation of defects in aMRAM system using alternative pulses, in accordance with someimplementations.

FIGS. 24A to 24F illustrate a cylindrical MRAM device that is configuredto inject and propagate one or more magnetic instabilities using theSpin Hall Effect (SHE), and the process of injecting and propagating theone or more magnetic instabilities via the SHE, in accordance with someimplementations.

FIGS. 25A and 25B illustrate injection and propagation of defects in acylindrical MRAM device using alternative pulses, in accordance withsome implementations.

Like reference numerals refer to corresponding parts throughout theseveral views of the drawings.

DETAILED DESCRIPTION

Reference will now be made in detail to implementations, examples ofwhich are illustrated in the accompanying drawings. In the followingdetailed description, numerous specific details are set forth in orderto provide a thorough understanding of the various describedimplementations. However, it will be apparent to one of ordinary skillin the art that the various described implementations may be practicedwithout these specific details. In other instances, well-known methods,procedures, components, circuits, and networks have not been describedin detail so as not to unnecessarily obscure aspects of theimplementations.

As described in greater detail below, a three-dimensional magneticmemory device may provide data storage and logic operations. Forexample, data (e.g., information) is stored as magnetic instabilities(also known as defects and/or kink-solitons) in an otherwisewell-ordered (e.g., having an anti-parallel or an anti-ferromagneticconfiguration) magnetic structure comprising two or more magneticlayers. The magnetic instabilities may be transferred (e.g., propagated)along the length of the device by switching a respective magnetizationdirection of at least one of the magnetic layers.

FIG. 1A is schematic diagram of a magnetic tunnel junction (MTJ)structure 100 (e.g., for use in an MRAM device) in accordance with someimplementations. In accordance with some implementations, the MTJstructure 100 is composed of a first ferromagnetic layer (referencelayer 102), a second ferromagnetic layer (storage layer 106), and anon-magnetic layer (spacer layer 104). The reference layer 102 is alsosometimes referred to as a pinned or fixed layer. The storage layer 106is also sometimes referred to as a free layer. The spacer layer 104 isalso sometimes referred to as a barrier layer (or a non-magnetic spacerlayer). In some implementations, the spacer layer 104 comprises anelectrically-insulating material such as magnesium oxide (MgO) orsilicon oxide.

In some implementations, the reference layer 102 and the storage layer106 are composed of the same ferromagnetic material. In someimplementations, the reference layer 102 and the storage layer 106 arecomposed of different ferromagnetic materials. In some implementations,the reference layer 102 is composed of a ferromagnetic material that hasa higher coercivity than the storage layer 106. In some implementations,the reference layer 102 and the storage layer 106 are composed ofdifferent ferromagnetic materials with the same or similar thicknesses(e.g., within 10%, 5%, or 1% of one another). In some implementations,the thickness of the reference layer 102 is different from that of thestorage layer 106 (e.g., the reference layer 102 is thicker than thestorage layer 106). In some implementations, the thickness of the spacerlayer 104 is on the order of a few atomic layers. In someimplementations, the thickness of the spacer layer 104 is on the orderof a few nanometers (nm). In some implementations, thicknesses of thereference layer 102, the spacer layer 104, and the storage layer 106 areuniform. In some implementations, thicknesses of the reference layer102, the spacer layer 104, and the storage layer 106 are not uniform(e.g., a first portion of the spacer layer 104 is thinner relative to asecond portion of the spacer layer 104).

In some implementations, the reference layer 102 and/or the storagelayer 106 is composed of two or more ferromagnetic layers separated fromone another with spacer layers. In some implementations, each of theseferromagnetic layers is composed of identical, or varying, thickness(es)and/or material(s). In some implementations, the spacer layers arecomposed of identical, or varying, thickness(es) and/or material(s) withrespect to one another.

Magnetic anisotropy refers to the directional dependence of a material'smagnetic properties. The magnetic moment of magnetically anisotropicmaterials will tend to align with an “easy axis,” which is theenergetically favorable direction of spontaneous magnetization. In someimplementations and instances, the two opposite directions along an easyaxis are equivalent, and the direction of magnetization can be alongeither of them (and in some cases, about them). For example, inaccordance with some implementations, FIG. 1B shows low energy states114 and 116 corresponding to opposite directions along an easy axis(additional examples are shown in FIGS. 10A-10B with reference to acylindrical three-dimensional MTJ structure).

In some implementations, the MTJ structure 100 is an in-plane MTJ. Inthis instance, the magnetic moments of the reference layer 102 and thestorage layer 106, and correspondingly their magnetization direction,are oriented in the plane of the ferromagnetic films of the referencelayer 102 and the storage layer 106.

In some implementations, the MTJ structure 100 is a perpendicular (orout-of-plane) MTJ. In this instance, the magnetic moments of thereference layer 102 and the storage layer 106, and correspondingly theirmagnetization direction, are oriented perpendicular and out-of-plane tothe ferromagnetic films of the reference layer 102 and the storage layer106.

In some implementations, the MTJ structure 100 has preferred directionsof magnetization at arbitrary angles with respect to the magnetic filmsof the reference layer 102 and the storage layer 106.

In accordance with some implementations, an MRAM device provides atleast two states such that they can be assigned to digital signals “0”and “1,” respectively. One storage principle of an MRAM is based on theenergy barrier required to switch the magnetization of a single-domainmagnet (e.g., switch the magnetization of the storage layer 106) fromone direction to the other.

FIG. 1B shows representative energy barriers of the reference layer 102and the storage layer 106 of the MTJ 100 in accordance with someimplementations. In accordance with some implementations, the energybarrier refers the amount of energy the magnetic material must overcomein order to switch from one magnetization direction to its opposite(e.g., from the state 114 to the state 116). In an MRAM device, themagnetization direction of the reference layer 102 is generallyconsidered fixed, while the magnetization direction of the storage layer106 is varied to store the “0” and “1” states. Accordingly, thereference layer 102 is composed of materials such that an energy barrier112 (E_(B, ref)) of the reference layer 102 is larger than the energybarrier 118 (E_(B, stor)) of the storage layer 106. In particular, FIG.1B shows low energy states 114 and 116 for the reference layer 102separated by the energy barrier 112, and shows low energy states 120 and122 for the storage layer 106 separated by the energy barrier 118. Insome implementations, the storage layer 106 is designed with materialsthat have a magnetic anisotropy that is high enough to store themagnetization over certain time duration (for e.g., 1 week, 1 month, 1year, or 10 years).

For an MRAM device with the MTJ structure 100, the resistance states ofthe MRAM devices are different when the magnetization directions of thereference layer 102 and the storage layer 106 are aligned in a parallel(low resistance state) configuration or in an anti-parallel (highresistance state) configuration, as will be discussed with respect toFIGS. 2A and 2B.

FIGS. 2A-2B illustrate magnetization orientations in a perpendicularmagnetic tunnel junction (pMTJ) structure 200 in accordance with someimplementations. In some implementations, the pMTJ structure 200 is thesame as the MTJ structure 100 presented in FIG. 1A, comprising: thereference layer 102, the spacer layer 104, and the storage layer 106. Insome implementations, the pMTJ structure 200 forms part of a MRAMdevice.

For the pMTJ structure 200 illustrated in FIGS. 2A and 2B, the fixedmagnetization direction 202 for the reference layer 102 is chosen to bein an upward direction and is represented by an up arrow. In someimplementations (not shown), the fixed magnetization direction of thereference layer 102 in the pMTJ structure 200 is in a downwarddirection.

FIG. 2A illustrates the magnetization directions of the storage andreference layers in a parallel configuration. In the parallelconfiguration, the magnetization direction 206 of the storage layer 106is the same as the magnetization direction 202 of the reference layer102. In this example, the magnetization direction 202 of the referencelayer 102 and the magnetization direction 206 of the storage layer 106are both in the upward direction. The magnetization direction of thestorage layer 106 relative to the fixed layer 102 changes the electricalresistance of the pMTJ structure 200. In accordance with someimplementations, the electrical resistance of the pMTJ structure 200 islow when the magnetization direction of the storage layer 106 is thesame as the magnetization direction 202 of the reference layer 102.Accordingly, the parallel configuration is also sometimes referred to asa “low (electrical) resistance” state.

FIG. 2B illustrates the magnetization directions of the storage andreference layers in an anti-parallel configuration. In the anti-parallelconfiguration, the magnetization direction 216 of the storage layer 106is opposite to the “fixed” magnetization direction 202 of the referencelayer 102. In accordance with some implementations, the electricalresistance of the pMTJ structure 200 is high when the magnetizationdirection 216 of the storage layer 106 is the opposite of themagnetization direction 202 of the reference layer 102. Accordingly, theanti-parallel configuration is sometimes also referred to as a “high(electrical) resistance” state.

Thus, by changing the magnetization direction of the storage layer 106relative to that of the reference layer 102, the resistance states ofthe pMTJ structure 200 can be varied between low resistance to highresistance, enabling digital signals corresponding to bits of “0” and“1” to be stored and read. Conventionally, the parallel configuration(low resistance state) corresponds to a bit “0,” whereas theanti-parallel configuration (high resistance state) corresponds to a bit“1”.

Although FIGS. 2A-2B show parallel and anti-parallel configurations withthe pMTJ structure 200, in some implementations, an in-plane MTJstructure, or an MTJ structure with an arbitrary preferred angle, isused instead.

FIGS. 3A-3D illustrate representative processes for switching the pMTJ200 between the parallel and anti-parallel configurations in accordancewith some implementations. In accordance with some implementations,spin-transfer torque (STT) is used to modify the magnetizationdirections of an MTJ. STT is an effect in which the magnetizationdirection of a ferromagnetic layer in an MTJ is modified using aspin-polarized current.

In general, electrons possess a spin, a quantized number of angularmomentum intrinsic to the electron. An electrical current is generallyunpolarized, e.g., it consists of 50% spin up and 50% spin downelectrons. When a current is applied though a ferromagnetic layer, theelectrons are polarized with spin orientation corresponding to themagnetization direction of the ferromagnetic layer, thus producing aspin-polarized current (or spin-polarized electrons).

As described earlier, the magnetization direction of the reference layer102 is “fixed” in an MTJ (e.g., the applied currents are insufficient tochange the magnetization state of the reference layer). Therefore,spin-polarized electrons may be used to switch the magnetizationdirection of the storage layer 106 in the MTJ (e.g., switch betweenparallel and anti-parallel configurations).

As will be explained in further detail, when spin-polarized electronstravel to the magnetic region of the storage layer 106 in the MTJ, theelectrons will transfer a portion of their spin-angular momentum to thestorage layer 106, to produce a torque on the magnetization of thestorage layer 106. When sufficient torque is applied, the magnetizationof the storage layer 106 switches, which, in effect, writes either a “1”or a “0” based on whether the storage layer 106 is in the parallel oranti-parallel configuration relative to the reference layer.

FIGS. 3A-3B illustrate the process of switching from the anti-parallelconfiguration to the parallel configuration. In FIG. 3A, the pMTJstructure 200 is in the anti-parallel configuration, e.g., themagnetization direction 302 of the reference layer 102 is opposite tothe magnetization direction 306 of the storage layer 106.

FIG. 3B shows application of a current such that electrons flow throughthe pMTJ 200 in accordance with electron flow 312. The electrons aredirected through the reference layer 102 which has been magnetized withthe magnetization direction 302. As the electrons flow through thereference layer 102, they are polarized (at least in part) by thereference layer 102 and have spin orientation corresponding to themagnetization direction 302 of the reference layer 102. The majority ofthe spin-polarized electrons tunnel through the spacer layer 104 withoutlosing their polarization and subsequently exert torque on theorientation of magnetization of the storage layer 106. When asufficiently large current is applied (e.g., a sufficient number ofpolarized electrons flow into the storage layer 106), the spin torqueflips, or switches, the magnetization direction of the storage layer 106from the magnetization direction 306 in FIG. 3A to the magnetizationdirection 316 in FIG. 3B.

Thus, as shown in FIG. 3B, the magnetization direction 316 of thestorage layer 106 is in the same (upward) direction as the magnetizationdirection 302 of the reference layer 102. Accordingly, the pMTJstructure 200 in FIG. 3B is in the parallel (low resistance state)configuration. In some implementations and instances, electrons thatpossess spins in the minority (opposite) direction are reflected at thebarrier interfaces and exert torque on the magnetization direction 302of the reference layer 102. However, the magnetization direction 302 ofthe reference layer 102 is not switched because the torque isinsufficient to cause switching in the reference layer 102.

FIGS. 3C-3D illustrate the process of switching from the parallelconfiguration to the anti-parallel configuration. In FIG. 3C, the pMTJstructure 200 is in the parallel configuration. To initiate switching tothe anti-parallel configuration, a current is applied such thatelectrons flow in accordance with electron flow 322 in FIG. 3D. Theelectrons flow from the storage layer 106 to the reference layer 102. Asthe electrons flow through the storage layer 106, they are polarized bythe storage layer 106 and have spin orientation corresponding to themagnetization direction 316 of the storage layer 106.

The MTJ structure 200 in FIG. 3C is in the parallel (low resistancestate) configuration and thus it has lower electrical resistance,therefore, in some implementations and instances, the majority of thespin-polarized electrons tunnel through the spacer layer 104. Minorityspin electrons that are polarized with direction opposite to themagnetization direction 316 of the storage layer 106 are reflected atthe barrier interfaces of the spacer layer 104. The reflected spinelectrons then exert torque on the magnetization 316 of the storagelayer 106, eventually leading to a switch of the magnetization direction316 of the storage layer 106 in FIG. 3C to a magnetization direction 326in FIG. 3D. Thus, the pMTJ structure 200 is switched from the parallel(low resistance state) configuration to the anti-parallel (highresistance state) configuration.

Accordingly, STT allows switching of the magnetization direction of thestorage layer 106. MRAM devices employing STT (e.g., STT-MRAM) offeradvantages including lower power consumption, faster switching, andbetter scalability, over conventional MRAM devices that use magneticfield to switch the magnetization directions. STT-MRAM also offersadvantages over flash memory in that it provides memory cells withlonger life spans (e.g., can be read and written to more times comparedto flash memory).

FIG. 4 is a schematic diagram of a spin transfer torque (STT) MRAMdevice 400 in accordance with some implementations. The includes an MTJdevice with the reference layer 102, the spacer layer 104, the storagelayer 106, and an access transistor 414. The MTJ device is coupled to abit line 408 and a source line 410 via transistor 414, which is operatedby a word line 412. The reference layer 102, the spacer layer 104, andthe storage layer 106 compose the MTJ structure 100 and/or the pMTJstructure 200, as described above with reference to FIGS. 1-3. In someimplementations, the STT-MRAM 400 includes additional read/writecircuitry, one or more additional transistors, one or more senseamplifiers, and/or other components (not shown).

The MTJ structure 100 and/or the pMTJ structure 200 is also sometimesreferred to as an MRAM cell. In some implementations, the STT-MRAM 400contains multiple MRAM cells (e.g., hundreds or thousands of MRAM cells)arranged in an array coupled to respective bit lines and source lines.During a read/write operation, a voltage is applied between the bit line408 and the source line 410 (e.g., corresponding to a “0” or “1” value),and the word line 412 enables current to flow between the bit line 408to the source line 410. In a write operation, the current is sufficientto change a magnetization of the storage layer 106 and thus, dependingon the direction of electron flow, bits of “0” and “1” are written intothe MRAM cell (e.g., as illustrated in FIGS. 3A-3D). In a readoperation, the current is insufficient to change the magnetization ofthe storage layer 106. Instead, a resistance across the MRAM cell isdetermined. e.g., with a low resistance corresponding to a logical “0”and a high resistance corresponding to a logical “1.”

In accordance with some implementations of the present disclosure, athree-dimensional magnetic memory device stores data in a lattice ofcells and passes data from cell to cell along a chain. In someimplementations, the lattice of cells comprises multiple magnetic layersthat are arranged in a stack. Data is passed (e.g., moved) from onemagnetic layer to another along the stack.

To this end, FIG. 5 illustrates an exemplary three-dimensional MRAMsystem 500 for implementing a unidirectional vertical shift registerbetween perpendicularly magnetized ferromagnets, in accordance with someimplementations.

FIG. 5 has been reproduced and adapted from Lavrijsen et al., “Magneticratchet for three-dimensional spintronic memory and logic,” Nature 493,647 (2013), which is incorporated by reference herein in its entirety.

The system (e.g., device) 500 is configured to receive a magnetic field502 (e.g., an externally applied magnetic field) and comprises aplurality of magnetic layers 504. Each of the magnetic layers 504comprises a ferromagnetic material and includes a perpendicularmagnetization direction. In other words, the magnetization directionsare oriented out of the plane of the ferromagnetic films of the magneticlayers 504.

In the example of FIG. 5, the odd-numbered magnetic layers (e.g., 504-1,504-3, 505-5 etc.) have a first thickness (t1) 516 and a firstperpendicular magnetization direction 508 that is indicated by thedirection of the block arrow (e.g., downward, or down). Theeven-numbered magnetic layers (e.g., 504-2, 504-4, 505-6 etc.) have asecond thickness (t2) 518 and a second perpendicular magnetizationdirection 510 (e.g., upward, or up) that is opposite to the firstperpendicular magnetization direction 508. Of course, the designation ofthe down and up directions for the first and the second perpendicularmagnetization directions in this instance are purely arbitrarily. Inother implementations, the first magnetization direction 508 is the updirection and the second magnetization direction 510 is in the down.direction.

In some implementations, the first thickness 516 and the secondthickness 518 are on the order of a few atomic layers (e.g., less thanone nanometer). In some implementations, the first thickness 516 and thesecond thickness 518 are on the order of one nanometer or a fewnanometers.

The system 500 further comprises a plurality of non-magnetic layers 506.As depicted in FIG. 5, two adjacent magnetic layers 504 are separated bya respective non-magnetic layer 506. Or, stated another way, twoadjacent non-magnetic layers 506 are separated by a respective magneticlayer 504.

In some implementations, the non-magnetic layers 506 have a thicknessthat is on the order of a few atomic layers (e.g., 0.8 nm) or on theorder of a few nanometers (e.g., 1.5 nm, 2.0 nm). In someimplementations, the thicknesses of the non-magnetic layers facilitatean exchange coupling (e.g., a Ruderman-Kittel-Kasuya-Yosida (RKKY)coupling) between adjacent magnetic layers 504 in the system 500.

In the example of FIG. 5, adjacent magnetic layers with magnetizationdirections pointing away from each other (e.g., the magnetic layers504-3 and 504-4) interact with each other via a first exchange coupling(J1) 512 (e.g., a first RKKY coupling), and adjacent magnetic layerswith magnetization directions pointing toward each other (e.g., themagnetic layers 504-4 and 504-5) interact with each other via a secondexchange coupling (J2) 514 (e.g., a second RKKY coupling).

Adjacent magnetic layers in the system 500 have opposite perpendicularmagnetization directions. Thus, the plurality of magnetic layers 504 isarranged in an antiferromagnetic configuration. In some implementations,the antiferromagnetic configuration depicted in FIG. 5 is a first groundstate (or a first stable state) of the system 500. In someimplementations, the system 500 includes a second ground state (or asecond stable state) which corresponds to the odd-numbered magneticlayers having an up magnetization direction and the even-numberedmagnetic layers having a down magnetization direction (not shown).

In some implementations, the plurality of magnetic layers 504 and theplurality of non-magnetic layers 530 collectively form a stack 530 ofthe system 500. In some implementations, the stack 530 is also referredto as a propagation stack (or a soliton propagation stack).

In some implementations, the stack 530 includes a few magnetic layers504 (e.g., five). In some implementations, the stack 530 includes tensof magnetic layers 504 (e.g., 15, 25, or 40 magnetic layers). In someimplementations, the stack 530 includes a hundred or more magneticlayers. In each instance, two adjacent layers are separated by anon-magnetic layer.

FIG. 6 illustrates another exemplary three-dimensional MRAM device 600for implementing a vertical (e.g., unidirectional) shift register inaccordance with some implementations.

The MRAM device 600 comprises an electrically-conductive andnon-magnetic core 602 that is configured to receive a current.

In some implementations, the core 602 is made from a metal (e.g., anon-magnetic metal) and serves as a current lead for the MRAM device600. In some implementations, the core 602 material includes at leastpartially, one or more of Tantalum (Ta) e.g., β-Ta), Tungsten (W) (e.g.,β-W), Copper (Cu), Ruthenium (Ru), and Niobium (Nb), or a combinationthereof. In the example of FIG. 6, the core 602 is cylindrical in shape.In other implementations, the core 602 may be conical or elliptical inshape.

The MRAM device 600 includes a plurality of magnetic layers 604 thateach surrounds (e.g., shares a common surface with) the core 602. Eachof the magnetic layers is annular in shape (e.g., ring-shaped). Theplurality of magnetic layers 604 includes a first magnetic layer 604-1with a first thickness (e.g., height) 616, and a second magnetic layer604-2 with a second thickness (e.g., height) 618. Each of the magneticlayers 604 has a magnetic ground state (e.g., a vortex magnetic groundstate, also referred to as a vortex magnetization) and a respectivemagnetization direction (e.g., a counterclockwise vortex magnetizationdirection 608 or a clockwise vortex magnetization direction 610).

In some implementations, the first magnetic layer 604-1 has a first setof characteristics, and the second magnetic layer 604-2 has a second setof characteristics that at least partially differ from the first set ofcharacteristics. In some implementations, the first and the second setsof characteristics include: (i) film thicknesses of the first and secondmagnetic layers; (ii) radii of the first and second magnetic layers; and(iii) materials (e.g., material compositions) of the first and secondmagnetic layers.

In some implementations, the plurality of magnetic layers 604 includes afirst plurality of pairs. Each of the first plurality of pairs includesa first magnetic member (e.g., a magnetic layer) and a second magneticmember (e.g., a magnetic layer). The first magnetic member has arespective set of characteristics (e.g., a material, a couplingcoefficient, a thickness etc.) and the second magnetic member hasanother respective set of characteristics (e.g., a material, a couplingcoefficient, a thickness etc.) that at least partially differ from thethat of the first magnetic member. In some implementations, each of thefirst magnetic members has the same characteristics and/or each of thesecond magnetic members has the same characteristics. In someimplementations, each of the first magnetic members has overlappingcharacteristics and/or each of the second magnetic members hasoverlapping characteristics. In other implementations, a subset ofrespective first magnetic members, and/or a subset of respective secondmagnetic members have different characteristics.

In some implementations, the first thickness (e.g., height) 616 isdistinct from the second thickness (e.g., height) 618. In someimplementations, the first thickness 616 is the same as the secondthickness 618. In some implementations, the first thickness 616 and/orthe second thickness 618 are on the order of a few atomic layers thick(e.g., less than one nanometer). In some implementations, the firstthickness 616 and/or the second thickness 618 are on the order of a fewnanometers (e.g., 1 nm, 2 nm, 5 nm etc.).

The device 600 also includes a plurality of non-magnetic layers 606 thateach surrounds the cylindrical core 602 (e.g., each magnetic layer 604and each non-magnetic layer 606 share a common surface with the core602).

In some implementations, the non-magnetic layers 606 have a thicknessthat is on the order of a few atomic layers (e.g., three to five atomiclayers, corresponding to ˜0.6 nm to 1 nm), or on the order of a fewnanometers (e.g., 1.5 nm, 2.3 nm). In some implementations, thethicknesses of the non-magnetic layers 606 enable an exchange coupling(e.g., a RKKY coupling) between adjacent magnetic layers 604 in thedevice 600.

In some implementation, the plurality of non-magnetic layers 606 couplesadjacent magnetic layers 604 that are separated by respectivenon-magnetic layers via the RKKY coupling mechanism.

As shown in FIG. 6, the plurality of magnetic layers 604 and theplurality of non-magnetic layers 606 are arranged in a vertical stack630 coaxial with the core 602, such that respective magnetic layers ofthe plurality of magnetic layers 604 are separated by (e.g.,interspersed between) respective non-magnetic layers of the plurality ofnon-magnetic layers 606. In other words, respective magnetic layers 604alternate with respective non-magnetic layers 606 in the stack 630, anda respective non-magnetic layer 606 is sandwiched between two magneticlayers 604 in the stack 630.

It will be apparent to one of ordinary skill in the art that the numberof magnetic layers 604 and the number of non-magnetic layers 606depicted in the MRAM device 600 of FIG. 6 is purely exemplary. In someimplementations, the device 600 may include a larger or smaller numberof magnetic layers 604 and non-magnetic layers 606. In someimplementations, the stack 530 includes a few magnetic layers 504 (e.g.,five or eight). In some implementations, the stack 530 includes tens ofmagnetic layers 504 (e.g., 15, 25, or 45 magnetic layers). In someimplementations, the stack 530 includes a hundred or more magneticlayers. In each of these instances, two adjacent layers are separated bya non-magnetic layer.

In practice, given that each magnetic layer 604 is fairly thin (e.g., onthe order of a couple of nm), one would not expect a significantvariation of diameter from one layer to the next. However, when stackingtens or hundreds to layers to form the stack 630 in order to achievelarge storage densities, one may expect to see variations of thediameters of the magnetic storage elements (e.g., the magnetic layers604) from the top to the bottom of the stack 630. This variation (ortapering) is observed in practice in magnetic nanostructures due thefabrication process methodology. In some implementations, by tailoringthe coupling fields J1 and J2, one can achieve significant switchingmargins to overcome the distributions of switching currents in a taperedstructure whose variations of the diameters does not exceed a thresholdpercentage (e.g., 10%, 15%, or 20%).

In some implementations, the first non-magnetic layer 606-2 has a thirdset of characteristics, and the second non-magnetic layer 606-3 has afourth set of characteristics that at least partially differ from thethird set of characteristics. In some implementations, the third and thefourth sets of characteristics include: (i) film thicknesses of thefirst and second non-magnetic layers; (ii) radii of the first and secondnon-magnetic layers; and (iii) materials of the first and secondnon-magnetic layers.

In some implementations, the plurality of non-magnetic layers 606includes a second plurality of pairs. Each of the second plurality ofpairs includes a first non-magnetic member (e.g., layer) and a secondnon-magnetic member (e.g., layer). The first non-magnetic member has arespective set of characteristics (e.g., a material, a couplingcoefficient, a thickness) and the second magnetic member has anotherrespective set of characteristics that at least partially differ fromthe that of the first non-magnetic member. In some implementations, eachof the first non-magnetic members has the same characteristics and/oreach of the second non-magnetic members has the same characteristics. Insome implementations, each of the first non-magnetic members hasoverlapping characteristics and/or each of the second non-magneticmembers has overlapping characteristics. In other implementations, asubset of respective first non-magnetic members, and/or a subset ofrespective second non-magnetic members have different characteristics.

In some implementations, each and every one of the layers 604 and 606 iscylindrical (e.g., annular, ring) in shape. In some implementations,when the core 602 is not cylindrical in shape, the inner surface of eachof the magnetic layers 604 and each of the non-magnetic layers 606conforms to the shape of the core 602.

In some implementations, each of the plurality of magnetic layers 604 iscomposed of a ferromagnetic material.

In some implementations and as shown in FIG. 6, the plurality ofmagnetic layers 604 is arranged in an antiferromagnetic configuration.In other words, adjacent magnetic layers are magnetized in oppositedirections.

In some implementations, one or more of the magnetic layers 604 arecomposed of permalloy.

In some implementations, each of the plurality of non-magnetic layers606 is composed of a non-magnetic metal (e.g., gold (Au) and/orruthenium (Ru)). In some implementations, the non-magnetic metal ischosen to match the structure of the ferromagnetic layers. For example,Ru which has a hexagonal closed-packing (HCP) structure may be chosen tomatch the HCP structure of a cobalt (Co) ferromagnetic layer. As anotherexample, Au which has a cubic structure (e.g., a face-centered cubicstructure) may be chosen to match with ferromagnetic Fe which also has acubic structure (e.g., a body-centered cubic structure).

In some implementations, the plurality of magnetic layers 604 and theplurality of non-magnetic layers 606 is collectively referred to as astack 630, or a pillar, or a propagation layer (or a propagationstack/structure/portion) of the MRAM device 600. In someimplementations, the stack 630 is also known as a soliton propagationratchet or a Spin Hall ratchet as it enables magnetic instabilities (ormagnetic defects) to be transported (e.g., unidirectionally) along thestack 640, as will be described later.

In some implementations, the cylindrical core 602 has a lower electricalresistance than a combined electrical resistance of the plurality ofmagnetic layers 604 and the plurality of non-magnetic layers 606 in thestack.

In some implementations, the MRAM device 600 has an outer diameter ofapproximately 20 nm. Alternatively, in some implementations, the outerdiameter of the MRAM device 600 is greater than (or less than) 20 nm.

The device 600 includes an input terminal 622 coupled to a first end ofthe core 602, and a current source 624 that is coupled to the inputterminal 622.

In some implementations, the current source 624 is configured to supplycurrent imparting a Spin Hall Effect (SHE) around the circumference(e.g., perimeter, and/or surface of the cylindrical core and/or surfaceof the cylindrical core that is coaxial with the magnetic andnon-magnetic layers) of the cylindrical core 602 (See also FIGS. 15, 24,and 25). As discussed in M. I. Dyakonov, “Spin Hall Effect,”arXiv:1210.3200 [cond-mat.mes-hall], which is hereby incorporated byreference in its entirety, the Spin Hall Effect (SHE) consists in spinaccumulation at the lateral boundaries of a current-carrying conductor,the directions of the spins being opposite at the opposing boundaries.For a cylindrical core, the spins wind around the surface of the core.The boundary spin polarization is proportional to the current andchanges sign when the direction of the current is reversed. The SpinHall effect is somewhat similar to the normal Hall effect, where chargesof opposite sign accumulate at the sample boundaries due to the actionof the Lorentz force in magnetic field. However, there are significantdifferences. First, no magnetic field is needed for spin accumulation.On the contrary, if a magnetic field perpendicular to the spin directionis applied, it will destroy the spin polarization. Second, the value ofthe spin polarization at the boundaries is limited by spin relaxation,and the polarization exists in relatively wide spin layers determined bythe spin diffusion length, typically on the order of one micron, asopposed to the much smaller Debye screening length where chargesaccumulate in the normal Hall effect.

In some implementations, each of the plurality of magnetic layers 604has a respective magnetization (e.g., a vortex magnetization), and theSHE imparted around the circumference of the core contributes to amagnetization of each of the plurality of magnetic layers.

In some implementations, the current source 624 is configured to supplya specific current to change a direction of magnetization (e.g., avortex magnetization) of a specific one of the plurality of magneticlayers 604 (e.g., from the clockwise magnetization direction 610 to thecounterclockwise magnetization direction 608, or vice versa).

In some implementations, the current source 624 is configured to supplya specific current to change a direction of magnetization of a specificset of the plurality of magnetic layers 604 (e.g., the specific setcomprising the odd-numbered layers of the plurality of magnetic layers604, or the even-numbered layers of the plurality of magnetic layers604).

In some implementations the device 600 includes an output terminal 620coupled to a second end of the cylindrical core 602 that is opposite tothe first end. The output terminal 620 is configured to provide acurrent readout to a readout component of the magnetic memory device 600and to form a close circuit with the input terminal 622. Details of thereadout component will be described in FIG. 12.

FIGS. 7A-7C illustrate possible magnetic ground states (ormagnetizations) for a magnetic layer 604 of a cylindrical MRAM structure(e.g., the cylindrical MRAM device 600), in accordance with someimplementations.

A magnetic ground state corresponds to the magnetic anisotropy of aferromagnetic layer (e.g., the first magnetic layer 604-1) of the MRAMdevice 600. As explained above with reference to FIG. 1A, a magneticmoment of magnetically anisotropic materials will tend to align with an“easy axis,” which is the energetically favorable direction ofspontaneous magnetization. In some implementations and instances, thetwo opposite directions along (or about) an easy axis are equivalent,and the direction of magnetization can be along (or about) either ofthem. As will be described in more detail with reference to FIGS. 8A-8B,the magnetic ground state for a ferromagnetic layer is dictated bycharacteristics of the ferromagnetic layer (e.g., height, thickness, andmaterial composition of the ferromagnetic layer) and the characteristicsof the core 602 (e.g., height, radius, and material composition of thecore 602). In the examples of FIGS. 7A to 7C, the first magnetic layer604-1 is identified as the one of the plurality of magnetic layers 604,but it will be apparent to one of ordinary skill in the art that thedescription is equally applicable to other ones of the plurality ofmagnetic layers 604.

FIG. 7A illustrates a vortex magnetic ground state 700 (or vortexmagnetization) in accordance with some implementations. In the vortexmagnetic ground state 700, a magnetic moment 702 (e.g., direction ofmagnetization) of the first annular/cylindrical ferromagnetic layer604-1 rotates around the core 602. For example, the core 602 ispositioned along an axis 704 and the magnetic moment 702 of firstmagnetic layer 604-1 rotates around (e.g., about) the axis 704 within(e.g., in-plane) the first cylindrical magnetic layer 604-1. In someimplementations, the magnetic moment 702 rotates around the core 602 ina clockwise direction (e.g., the clockwise magnetization direction 610).Alternatively, in some implementations, the magnetic moment 602 rotatesaround the core 602 in a counterclockwise direction (e.g., thecounterclockwise magnetization direction 608). Although not shown inFIG. 7A, the magnetic moment 702 of the first magnetic layer 604-1rotates around the core 602 through a cross section of the firstmagnetic layer 604-1.

FIG. 7B illustrates a perpendicular magnetic ground state (orperpendicular magnetization) in accordance with some implementations.The arrows 712 represent a direction of the magnetic moment of the bulkmaterial of the first magnetic layer 604-1 (e.g., the firstferromagnetic layer). In some implementations, the magnetic field lines(not shown) extend out of a planar surface 714 of the first magneticlayer 604-1 in the same direction represented by the arrows 712 (e.g.,upwards) and in doing so, the magnetic moment 712 of the bulk materialof the first magnetic layer 604-1 parallels the axis 704 of the core602. In some implementations, the magnetic moment 712 of the bulkmaterial of the first magnetic layer 604-1 parallels the axis 704 of thecore 602 and the magnetic field in a first direction (e.g., upwards).Alternatively, in some implementations (not shown), the magnetic moment712 of the bulk material of the first magnetic layer 604-1 parallels theaxis 704 of the core 602 and the magnetic field in a second direction(e.g., downwards). Although not shown in FIG. 7B, the magnetic moment712 of the bulk material of the first magnetic layer 604-1 extendsthrough a cross section of the first magnetic layer 604-1.

FIG. 7C illustrates an in-plane magnetic ground state (or in-planemagnetization) in accordance with some implementations. In the in-planemagnetic ground state, a magnetic moment 722 of the first magnetic layer604-1 parallels the planar surface 714 of the first magnetic layer604-1. In doing so, the magnetic moment 722 of the first magnetic layer604-1 is perpendicular to the axis 704 of the core 602. In someimplementations, the magnetic moment 722 parallels the planar surface714 of the first magnetic layer 604-1 in a first direction (e.g.,rightwards). Alternatively, in some implementations, the magnetic moment722 parallels the planar surface 714 of the first cylindricalferromagnetic layer 502 in a second direction (e.g., leftwards).Although not shown in FIG. 7C, the magnetic moment 722 of the firstmagnetic layer 604-1 extends through the cross section of the firstmagnetic layer 604-1. Because the structure possesses radial symmetry,every magnetization direction is energetically equivalent in the radialplane in the in-plane ground state. Accordingly, the magnetizationdirection may be equally likely to be pointing rightwards or leftwardsor in any other direction in the radial plane. In some implementationsand situations, this ground state (e.g., having a magnetic layer withthe in-plane magnetic ground state) is not preferred when it comes toencoding information as there is no energy barrier to overcome to gofrom the anti-parallel to the parallel configuration and the systemcould assume any angular configuration in-between which is not ideal forstoring a bit.

In some implementations, material composition of a ferromagnetic layeris tailored to a specific magnetic ground state. For example,ferromagnetic layers with a lower exchange energy prefer the vortexmagnetic ground state 700 (e.g., lower relative to a baseline). In someimplementations, lowering the exchange energy of a ferromagnetic layeris achieved by increasing and/or decreasing a proportion of one or moreelements/compounds that compose the ferromagnetic layer. For example,increasing a proportion of Fe (e.g., from a baseline) in theferromagnetic layer deceases the exchange energy of the ferromagneticlayer. Additionally, and/or alternatively, lowering the exchange energyof a ferromagnetic layer is achieved by using a combination (bilayer) ofCoFeB and other layers, such as permalloy, which lowers the overallexchange stiffness of the layer.

Conversely, in some implementations, ferromagnetic layers with a highexchange energy prefer for the perpendicular magnetic ground state 710.For example, increasing a proportion of Co (e.g., from a baseline) inthe ferromagnetic layer increases an exchange energy of theferromagnetic layer. Other material properties, such as saturationmagnetization and uniaxial anisotropy, are also considered fortailoring.

FIGS. 8A and 8B are phase diagrams showing the relationship betweendimensions of the cylindrical MRAM device 600 and the various magneticground states (e.g., perpendicular, in-plane, and vortex magnetic groundstates) for permalloy and iron ferromagnetic layers respectively, inaccordance with some implementations.

In some implementations, the vortex magnetic ground state that isdepicted in FIGS. 6 and 7A is the preferred magnetic ground state forMRAM devices that are used as magnetic shift registers (or as Spin Hallratchets).

A magnetic ground state of a magnetic layer 604 (e.g., a ferromagneticlayer) is based, at least in part, on a set of characteristics of themagnetic layer 604. In some implementations, the set of characteristicsincludes one or more of: (i) a thickness (e.g., radius or annularradius) of the ferromagnetic (e.g., permalloy) layer, (ii) a height ofthe ferromagnetic layer, (iii) exchange energy of the ferromagneticlayer, (iv) saturation magnetization of the ferromagnetic layer, and (v)uniaxial anisotropy of the ferromagnetic layer. Additionally, in someimplementations, the magnetic ground state of the magnetic layer 604 isfurther based on a set of characteristics of the core 602. In someimplementations, the set of characteristics of the core 602 includes oneor more of: (i) a radius of the core 602 relative to the thickness ofthe ferromagnetic layer and (ii) a height of the core 602.

A legend 820 illustrates dimensions discussed below with reference tothe phase diagrams in FIGS. 8A and 8B. Here, “Pillar Height” refers tothe height of an individual cylindrical magnetic layer. In someimplementations and according to FIGS. 8A and 8B, the “pillar height”(Y-axis of the phase diagrams) ranges from 0 to 60 nm. “Film thickness”refers to the radial thickness (R_(outer)-R_(inner)) of the annularlayer. In some implementations and according to FIGS. 8A and 8B, the“film thickness ranges from 0 to 5 nm. These numbers are exemplary andthe actual numbers could be increased or decreased. “Radius” refers to acombined radius of the core 602 and the radius of the annular magneticand non-magnetic layers. The “Radius” is a fixed dimension (e.g., 5 nm,7 nm, 10 nm, 15 nm, 20 nm, etc.), and therefore an increase in the filmthickness results in a corresponding decrease in the radius of the core602 (and vice versa). In some implementations, the stack comprisesmagnetic layers and non-magnetic layers having different filmthicknesses and the X-axis corresponds to an average film thickness ofthe stack in these instances.

The phase diagrams of FIG. 8A show that the perpendicular magneticground state 710 tends to form in tall (e.g., elongated) cylindricalMRAM structures with small film thicknesses (e.g., magnetic layershaving relatively small annular radii, or are thin relative to a radiusof the core 602 and/or the Radius of the vertical stack 630). In someimplementations or instances, the perpendicular magnetic ground state712 tends to form when a ratio between the pillar height and thewidth/thickness of the magnetic layer 604 satisfies a threshold, wherethe ratio corresponds to an energetically favorable direction ofspontaneous magnetization. For example, when the ratio between thepillar height and the film thickness satisfies the threshold, meaningthat the magnetic layer 604 is sufficiently tall and thin, theenergetically favorable direction of spontaneous magnetization is alongthe height (e.g., in a height dimension, as shown by the upward arrows)of the magnetic layer 604. Such is the result because it isenergetically more favorable for the magnetic moment of the magneticlayer 604 to lie along the axis of the core (in the height direction)than it is for the magnetic moment to lie in the plane (e.g., along thewidth), based on the dimensions of the magnetic layer 604 (e.g., theheight dimension is the “easy axis”).

In some implementations or instances, the parallel (or in-plane)magnetic ground state 720 tends to form when the ratio between thepillar height and the film thickness does not satisfy the threshold. Thein-plane magnetic ground state 720 favors “short” cylindrical MRAMstructures (e.g., having small pillar heights) with “thick”ferromagnetic film layers (e.g., thick relative to the pillar height).In such cases, it is easier for the magnetic moment of the firstferromagnetic layer 604-1 to lie perpendicular to the axis of the core602 (in the thickness dimension) than it is for the magnetic moment tolie perpendicular to the axis of the core, based on the dimensions ofthe first ferromagnetic layer 604 (e.g., the thickness dimension is the“easy axis”).

As shown in FIG. 8A, for a magnetic layer comprising permalloy, theperpendicular magnetic ground state 720 occupies the majority of thephase diagrams (i), (ii), and (iii). The phase diagrams (iii) and (iv)show that as the radius increases, the vortex magnetic ground state 700(or vortex magnetization) becomes increasingly favorable for permalloymagnetic layers having large film thicknesses and large pillar heights.

In some implementations and as shown in the phase diagrams of FIGS.8A(i) and 8A(ii), a magnetic film with a sub-nm pillar height mayexhibit a vortex magnetic ground state when the device radius is 10 nmor more. Accordingly, one may pack (e.g., densely pack) many layers ontop of each other and still achieve a small pillar height.

The phase diagrams of FIG. 8B show that the vortex magnetic ground statetends to form in cylindrical MRAM devices whose magnetic layers compriseiron, and with radii ranging from 5 nm to 15 nm.

FIGS. 9A-9B shows representative energy barriers that at least partiallycorrespond to the phase diagrams of FIGS. 8A-8B in accordance with someimplementations. It should be noted that the “Height” and the“Thickness” in FIGS. 9A and 9B have the same definition as the “PillarHeight” and “Film thickness” described in FIGS. 8A and 8B. Thedimensions for “Height” and “Thickness” shown in FIGS. 9A-9B are merelyone set of possible dimensions.

FIG. 9A shows a representative energy barrier 900 that at leastpartially corresponds to the phase diagram 800 of FIG. 8A. An “energybarrier” refers to the amount of energy the magnetic material mustovercome in order to switch from one magnetization direction to itsopposite (e.g., from the state 114 to the state 116, FIG. 1B). Thus, asthe energy barrier for a ferromagnetic layer increases, theferromagnetic layer is said to become more thermally stable. Increasingthe thermal stability of a ferromagnetic layer results in a greaterenergy input being required to switch the magnetization direction of theferromagnetic layer. With reference in FIG. 9A, as pillar height andfilm thickness of the ferromagnetic layer increases, the representativeenergy barrier 900 for the ferromagnetic layer also increases. In thisparticular example, the increase in thermal stability is fairly uniform.

In some implementations, the magnetic ground state of the ferromagneticlayer affects the thermal stability of the ferromagnetic layer. Forexample, if the ferromagnetic layer is in a first magnetic ground state(e.g., the vortex magnetic ground state), then the thermal stability ofthe ferromagnetic layer may differ from a thermal stability of aferromagnetic layer in a second magnetic ground state (e.g., theperpendicular magnetic ground state). To illustrate, with reference toFIG. 9B, the region 904 (dotted circle) shows an energy barrier bulge inthe representative energy barrier 910, which is not present in therepresentative energy barrier 900 (e.g., the region 902 (dotted circle)does not include a corresponding energy barrier bulge and insteadcontinues uniformly upwards toward a peak energy barrier). The energybarrier bulge 904 shown in FIG. 9B, in some circumstances, is caused bythe ferromagnetic layer being in the vortex magnetic ground state (e.g.,FIG. 8A). The energy barrier bulge 904 corresponds to the vortexmagnetization region shown in the bottom left phase diagram of FIG. 8A.

FIGS. 10A-10B show representative energy barriers of a ferromagneticlayer in different magnetic ground states in accordance with someimplementations. As discussed above, the energy barrier refers to theamount of energy the magnetic material must overcome in order to switchfrom one magnetization direction to its opposite (e.g., from the state1002 to the state 1004). FIG. 10A shows low energy states 1002 and 1004for a ferromagnetic layer in a vortex magnetic ground state and multipleenergy barriers 1006-A, 1006-B, and 1006-C. In this example, the lowenergy state is achieved in both 1002 and 1004 magnetic configurations,1002 corresponds to a counterclockwise magnetization direction and 1004corresponds to a clockwise magnetization direction. 1002 and 1004 haveequivalent energies at equilibrium without external perturbations.

FIG. 10B shows low energy states 1012 and 1014 for a ferromagnetic layerin a perpendicular magnetic ground state and multiple energy barriers1016-A and 1016-B. In this example, the low energy state 1012corresponds to a first magnetization direction of the perpendicularmagnetic ground state (e.g., upwards) and the lower energy state 1014corresponds to a second magnetization direction of the perpendicularmagnetic ground state (e.g., downwards). In some implementations, arespective energy barrier for the ferromagnetic layer in the vortexmagnetic ground state differs from a respective energy barrier for theferromagnetic layer in the perpendicular magnetic ground state (e.g.,less energy is required to overcome the energy barrier 1006 relative toan amount of energy required to overcome the energy barrier 1016, orvice versa). It is noted that the illustrated A Energies are notnecessarily drawn to scale.

In some implementations or instances, a first ferromagnetic layer in afirst magnetic ground state with a first set of characteristics has anenergy barrier (e.g., energy barrier 1006-A) that differs from an energybarrier (e.g., energy barrier 1006-B) of a second ferromagnetic layer inthe first magnetic ground state with a second set of characteristics.Put plainly, as discussed above with reference to FIGS. 8A-8B and 9A-9B,an energy barrier for a ferromagnetic layer will differ depending on ageometry of the ferromagnetic layer. To illustrate, FIG. 10A includesthree different energy barriers 1006-A, 1006-B, and 1006-C, whichgradually increase as a result of the geometry of the ferromagneticlayer changing (e.g., increase in layer thickness and/or decrease inlayer height). Further, FIG. 10B includes two different energy barriers1016-A and 1006-B, which gradually increase as a result of the geometryof the ferromagnetic layer changing (e.g., decrease in layer thicknessand/or increase in layer height).

In some implementations, the magnetic ground state of the ferromagneticchanges momentarily from a first magnetic ground state in the low energystates (e.g., vortex magnetic ground state at low energy states 1002 and1004) to a second magnetic ground state in a high energy state (e.g.,perpendicular magnetic ground state at high energy state 1007). Toillustrate this phenomenon, assume the “angle” of the low energy state1002 is “0” degrees and further assume the angle of the low energy state1004 is “180” degrees (e.g., the low energy state 1004 is opposite tothe low energy state 1002). Thus, the midpoint between the two lowenergy states is “90” degrees (e.g., the angle at the high energy stateis perpendicular to the respective angles at low energy states 1002 and1004). Accordingly, as shown in FIG. 10A, the ferromagnetic layermomentarily has the perpendicular magnetic ground state 1007 whenswitching from the counterclockwise vortex magnetization direction tothe clockwise vortex magnetization direction (e.g., at the high energystate). A similar result is illustrated in FIG. 10B. For example, theferromagnetic layer momentarily has either the vortex magnetic groundstate 1018 or the parallel magnetic ground state 1019 when switchingfrom the upwards to downwards.

FIG. 11 provides representative energy barrier equations for variousmagnetization orientations in accordance with some implementations. Theparameters labeled in FIG. 11 (e.g., exchange energy, demagnetization(demag) anisotropy, uniaxial anisotropy, inner diameter, and externaldiameter) relate to characteristics of the first ferromagnetic layer, asdiscussed above (e.g., magnetization orientation tailoring).Additionally, changing one or more of the parameters in the variousequations may result in an energy barrier for the first ferromagneticlayer also changing (e.g., as shown in FIGS. 10A-10B). For ease ofillustration and discussion, the barrier layer 504 and the secondcylindrical layer 506 are not included in FIG. 11. However, one skilledin the art will appreciate that the equations apply equally to thesecond ferromagnetic layer 506.

As described in FIG. 6, the MRAM device 600 includes the output terminal620 that is coupled to the second end of the cylindrical core 602opposite to the first end. In some implementations, the output terminal620 of the MRAM device is configured to provide a current readout to areadout component 1200.

FIG. 12 illustrates the readout component 1200 for the MRAM device 600,in accordance with some implementations.

In some implementations, in order to utilize the SHE to write the stateof the MRAM device 600, the radial thicknesses of the magnetic layers604 need to be fairly narrow, which precludes being able to read out onthe top of the MRAM device 600. In some implementations, the read out isaccomplished using a concentric Magnetic Tunnel Junction MTJ thatcomprises a “inner magnetic metal/insulator/outer magnetic metal”structure, in which the inner magnetic metal comprises one or more ofthe magnetic layers 604 in the stack 630 and the outer magnetic metalcomprises a concentric ferromagnetic layer (e.g., a Fe layer) distinctfrom the magnetic layers 604 and having a fixed vortex magnetizationstate. By passing current radially through the MRAM device 600, thetunneling current would depend on the relative alignment of themagnetization of the magnetic layers in the ratchet and themagnetization in the outer layer of the device, thereby enabling areadout of the magnetic state of the underlying (e.g., inner) magneticlayers in the ratchet 630.

In some implementations, the readout component 1200 is annular (e.g.,ring) in shape and includes a concentric (e.g., annular, ring-shaped)spacer layer 1202 and a concentric (e.g., annular, ring-shaped)ferromagnetic layer 1204 that surrounds the spacer layer 1202. Thereadout component 1200 has an inner diameter 1208, an outer diameter1212, and a height 1206. The ferromagnetic layer 1204 has a fixed (e.g.,predefined) magnetization direction (e.g., a vortex magnetization).

In some implementations the readout component 1200 is coaxial with thecylindrical core 602 and surrounds a region of the stack 630. The innerdiameter 1208 of the readout component 1200 is designed to fit over thestack 630 (e.g., the inner diameter 1208 matches the outer diameter ofthe stack 630). Thus, the readout component surrounds (e.g., overlapswith) a portion of the trunk of the stack 630, e.g., a top portion, amiddle portion, a bottom portion of the stack 630. The area/volumedefined by the inner diameter 1208 and the height 1206 includes at leastone magnetic layer of the plurality of magnetic layers 604 of the stack630.

Accordingly, the ferromagnetic layer 1204, the spacer layer 1202, andthe at least one magnetic layer of the plurality of magnetic layers 604of the stack 630 forms an MTJ structure (e.g., in the MTJ structure 100in FIG. 1A). Here, the ferromagnetic layer 1204 is the reference layerand the at least one magnetic layer of the plurality of magnetic layers604 is the free (or storage) layer. The resistance state of the readoutcomponent 1200 is determined by the fixed magnetization direction of theferromagnetic layer 1204 and the effective magnetization of the at leastone magnetic layer of the plurality of magnetic layers 604 (e.g., thefree layer). For example, when the magnetization (e.g., vortexmagnetization) of the ferromagnetic layer 1204 is aligned in the samedirection as the effective magnetization of the at least one magneticlayer of the plurality of magnetic layers 604 in the stack 630, thereadout component 1200 corresponds to a parallel configuration. Theparallel configuration is also sometimes referred to as a “low(electrical) resistance” state. Alternatively, when the magnetization(e.g., vortex magnetization) of the ferromagnetic layer 1204 is alignedin the opposite direction as the effective magnetization of the at leastone magnetic layer of the plurality of magnetic layers 604 in the stack630, the readout component 1200 corresponds to an anti-parallelconfiguration. The anti-parallel configuration is also sometimesreferred to as a “high (electrical) resistance” state.

In some implementations, the area/volume defined by the inner diameter1208 and the height 1206 includes exactly one magnetic layer 604 in thestack 630. In this instance the single magnetic layer is the free layer.Thus, when the magnetization direction of the exactly one magnetic layer604 is aligned in the same direction as the fixed magnetizationdirection of the ferromagnetic layer 1204, it corresponds to the “low(electrical) resistance” state (e.g., bit “0”). When the magnetizationdirection of the exactly one magnetic layer 604 is aligned in theopposite direction as the fixed magnetization direction of theferromagnetic layer 1204, it corresponds to the “high (electrical)resistance” state (e.g., bit “1”).

In some implementations, the height 1206 of the readout component 1200corresponds to the surrounding of a single magnetic layer 604 in thestack 630. In this instance the single magnetic layer is the free layer.

In some implementations, the area/volume defined by the inner diameter1208 and the height 1206 includes two or more magnetic layers 604 in thestack 630. In this instance, the two or more magnetic layers surroundedby the readout component act as the free layer and the magnetizationdirection of the free layer is the effective magnetization direction ofthe two or more layers. In some implementations, the effectivemagnetization of the two or more layers can be calculated by treatingthe system as multiple MTJs in parallel and calculating the effectiveparallel magnetization (e.g., resistance).

In some implementations and as illustrated in FIG. 12, the readoutcomponent 1200 further includes a readout terminal 1210 that isconnected to the ferromagnetic layer 1204. The readout terminal 1210 isconfigured to close a readout circuit with the output terminal 620.

In some implementations, the spacer layer 1202 is composed of adielectric material. In some implementations, the dielectric material isan insulator material. In some implementations, the spacer layerincludes MgO.

In some implementations, the MRAM device 600 includes multiple readoutcomponents 1200, each readout component 1200 surrounding (e.g.,overlapping with) a respective distinct portion of the stack 630. Thus,each of the readout components 1200 forms an MTJ structure with the atleast respective one magnetic layer of the plurality of magnetic layers604 that it surrounds, and each of the readout components 1200effectively reads out a low resistance state and or a high resistancestate depending on the magnetization direction of the at leastrespective one magnetic layer of the plurality of magnetic layers 604and the fixed magnetization of the respective ferromagnetic layer 1204.

FIGS. 13A to 13K illustrate an exemplary process for shifting magneticbits in the perpendicularly magnetized ferromagnetic layers of the MRAMsystem 500 (e.g., MRAM device) of FIG. 5.

In some implementations, by controlling the thickness of each magneticlayer (e.g., the magnetic layer 504) and the exchange coupling (e.g.,the first coupling 512 and the second coupling 514) between the layers,the MRAM system 500 acts like a ratchet that allows information in theform of a sharp magnetic kink soliton to be unidirectionally pumped(e.g., moved, shifted, or propagated) from one magnetic layer toanother.

In the numerical example illustrated by FIGS. 13A to 13K, the blockarrows in each of the magnetic layers 504 represent the actualmagnetization direction (e.g., up or down) of the layer. The MRAM system500 has the following values: first thickness (t₁) 516=0.7 nm; secondthickness (t₂) 518=0.8 nm; first coupling (J₁) 512=650 Oe nm; secondcoupling (J₂) 514=180 Oe nm; and coercive field H_(C)=230 Oe. It isnoted that a positive coupling value (i.e., J>0) represents anantiferromagnetic coupling and a negative coupling value (i.e., J<0)represents a ferromagnetic coupling. In FIG. 13A, the MRAM system 500 isin an antiferromagnetic configuration.

In some implementations, information in the system 500 (e.g., in theform of magnetic bits of “1” and “0,” formed by adjacent magneticlayers) is shifted when the magnetization direction of a respectivemagnetic layer 504 is switched. To switch a particular magnetic layer504, one must overcome both its coercive field (H_(c)) and theantiferromagnetic coupling with its neighbors (e.g., the magnetic layersthat are immediately above and below the particular magnetic layer). Theswitching field (in Oe) of the i^(th) magnetic layer, H_(SW)(i), may becomputed using:H _(SW)(i)=−μ_(i) H _(C)+(μ_(i−1) J _(i−1/2)+μ_(i+1) J _(i+1/2))/t_(i)  (1)

where μ_(i) denotes the sign of the magnetization of the i-th magneticlayer μ_(i)=M_(i)/|M_(i)|, H_(C) is the coercive field, J_(i) is thecoupling of the i^(th) magnetic layer and t_(i) is the thickness of thei^(th) magnetic layer.

Suppose μ_(i)=−1, and correspondingly μ_(i+1)=μ_(i−1)=1, the downwardswitching field H_(SW)(down), defined here as the switching fieldrequired to switch a magnetic layer to the down magnetization directionfrom the up magnetization direction, is:H _(SW)(down)=H _(C)+(J ₁ +J ₂)/t _(i)  (2)

Suppose μ_(i)=1, and correspondingly μ_(i+1)=μ_(i−1)=−1, the upwardswitching field H_(SW)(up), defined here as the switching field requiredto switch a magnetic layer to the up magnetization direction from thedown magnetization direction, is:H _(SW)(up)=−H _(C)−(J ₁ +J ₂)/t _(i)  (3)

FIG. 13A shows the computed values of the switching fields H_(SW) (inOe) next to each of the magnetic layers 504. Because of the differentvalues of t₁ and t₂, the magnetic layers having an up magnetizationdirection (e.g., 504-2, 504-4 etc.) have a different switching fieldH_(SW) from the magnetic layers having a down magnetization direction(e.g., 504-1, 504-3 etc.). To switch a magnetic layer from the updirection to the down direction requires an applied field ofH>H_(SW)(down). To switch a magnetic layer from the down direction tothe up direction requires an applied field H<H_(SW)(up).

FIG. 13B, which has been adapted from Lavrijsen et al., shows a magneticinstability in the system 500 in accordance with some implementations. Amagnetic instability (or a defect) is associated with two adjacentmagnetic layers having a same magnetization direction. Suppose a devicehas a ground state comprising a sequence of “up” and “down”magnetization directions (Obviously the reverse sequence is also anacceptable magnetic ground state). A magnetic instability (or a defect)is then identified as a transition from the ground state to its reversesequence. For a simple antiferromagnetic structure “up-down” a defectwill exhibit two consecutive layers with the same orientation (e.g.,going from “up-down” to “down-up” or vice versa). In someimplementations, a magnetic instability formed by two adjacent magneticlayers is also known as a sharp kink soliton (or a soliton). Allmagnetic layers either above or below need to be switched to return thesystem to the ground state. In some implementations, information iscontained in two adjacent magnetic layers. In some implementations,information is contained in two adjacent magnetic layers having the samemagnetization direction.

FIG. 13B shows that the MRAM system 500 is in an antiferromagneticconfiguration with the exception of the adjacent magnetic layers 504-5and 504-6 that are both magnetized in the upward magnetizationdirection. In this instance, the lowest-energy position of a soliton toreside is between layers coupled by J2, because J2<J1. In other examplesand instances (e.g., in systems having different coupling values and/orthicknesses), the magnetic instability may be located in another twoadjacent magnetic layers and/or may have a different magnetizationdirection (e.g., a downward magnetization direction). In someimplementations, the system 500 may have more than one magneticinstability. Each of the magnetic instabilities is associated with twoadjacent magnetic layers that both have an upward or a downwardmagnetization direction.

FIG. 13C shows the computed values of the switching fields H_(SW) foreach of the magnetic layers 504 in the system 500. The switching fieldrequired to switch the magnetic layer 504-5 from the up magnetizationdirection to the down magnetization direction, H_(SW,1)(defect,down), isgiven by Equation 2A:H _(SW,1)(defect,down)=H _(C)+(J ₁ −J ₂)/t ₁  (2A)

The switching field required to switch the magnetic layer 504-6 from theup magnetization direction to the down magnetization direction,H_(SW,2)(defect,down), is given by Equation 2B:H _(SW,2)(defect,down)=H _(C)+(J ₁ −J ₂)/t ₂  (2B)

Notice that the sign in front of J₂ in both Equations (2A) and (2B) isnegative. This is because of the presence of a defect which means thatthe sign of the magnetization of the (i−1)th layer is the same as thesign of the i-th layer, namely μ_(i−1)=μ_(i)=μ_(i+1).

When a magnetic field (e.g., an external magnetic field) is applied, themagnetic layer that has the lowest switching field is the first magneticlayer to change (e.g., reverse, flip) its magnetization direction. InFIG. 13C, the magnetic layer 504-6 has the lowest switching field andthus it is the first magnetic layer to switch its magnetizationdirection.

FIG. 13D shows the application of a magnetic field (e.g., an externalmagnetic field) of 850 Oe to the MRAM system 500. Since the appliedfield of 850 Oe is larger than the switching field of the magnetic layer504-6 (e.g., 818 Oe), the magnetization direction of the magnetic layer504-6 switches from the up direction to the down direction, asillustrated in FIG. 13E. The applied field of 850 Oe is too small tocause the remaining magnetic layers having the up magnetizationdirection to switch. The switching (or “flipping”) of the magnetizationdirection in the layer 504-6 causes the soliton to move (e.g.,propagate) one layer up. The magnetic instability is now located at themagnetic layers 504-6 and 504-7, as denoted in FIG. 13F. Here, both themagnetic layers 504-6 and 504-7 have the down magnetization direction.

FIG. 13F also shows the updated switching values for each of themagnetic layers 504 as a result of the moving of the magneticinstability. The switching fields of the magnetic layer 504-6 and itstwo neighboring layers have changed. The switching field required toswitch the magnetic layer 504-7 from the down direction to the updirection, H_(SW,1)(defect,up) is given by Equation 3A:H _(SW,1)(defect,up)=−H _(C)−(J ₂ −J ₁)/t ₁  (3A)

The switching field required to switch the magnetic layer 504-6 from thedown magnetization direction to the up magnetization direction,H_(SW,2)(defect,up), is given by Equation 3B:H _(SW,2)(defect,up)=−H _(C)−(J ₂ −J ₁)/t ₂  (3B)

In some implementations and instances, the defect layers 504-6 and 504-7are metastable. They have a positive switching field even though theyare in the down direction (e.g., as if the magnetization direction werepointing upward).

FIG. 13G shows a reduction in the applied field from 850 Oe to 400 Oewhich is below the threshold switching field for the metastable defectmagnetic layer 504-7 (441 Oe). Thus, the magnetization direction of themagnetic layer 504-7 switches from the down direction to the updirection, as illustrated in the transition from FIG. 13G to FIG. 13H.Accordingly, the soliton propagates one layer up in the stack 530,resulting in the formation of a defect (e.g., magnetic instability) inthe magnetic layers 504-7 and 504-8, as illustrated in FIG. 13I. FIG.13I also clarifies that the switching fields of the magnetic layers 504that are marked with a hash (#) are governed by conditions (I) (i.e.,Equations 2, 2A, and 2B) whereas the switching fields of the magneticlayers 504 that are marked with an asterisk (*) are governed by theconditions (II) (i.e., Equations 3, 3A, and 3B).

FIG. 13J presents a summary for the kink soliton ratchet of the MRAMsystem 500. In some implementations, the direction of propagation of themagnetic instability (e.g., defect) in the MRAM system 500 isunidirectional (e.g., upwards or downwards). In some implementations,the magnetic instability (or defect) can be propagated upwards ordownwards by changing one or more parameters including an exchangecoupling value (J) and/or a thickness value (t). In the example of FIG.13, the conditions J₁>J₂ and t₁<t₂ ensure upward soliton ratchet action.

FIG. 14A to 14D illustrate two magnetic ground states of an MRAMstructure 1400 and a numerical example of the process for shiftingmagnetic bits in the structure 1400, in accordance with someimplementations. FIG. 14 has been adapted from Lavrijsen et al.,“Multi-bit operations in vertical spintronic shift registers,” which isincorporated by reference herein in its entirety. In someimplementations, the MRAM structure 1400 is known as a three-layer-cellratchet.

MRAM systems of various configurations may be designed by varying one ormore of: a type of exchange coupling (e.g., ferromagnetic oranti-ferromagnetic coupling), a strength (e.g., value) of exchangecoupling, and thickness(es) of the magnetic layers and non-magneticlayers. FIG. 14A shows two ground states of an MRAM structure 1400 thatcomprises a plurality of magnetic layers 1404 and a plurality ofnon-magnetic layers 1406. The actual number of the magnetic layers 1404and the non-magnetic layers 1406 shown in FIG. 14 is merely exemplary.In some implementations, the MRAM structure 1400 comprises a unit cellthat contains three magnetic and three non-magnetic layers. A groundstate has unit cells “up-up-down” (FIG. 14A) or “down-down-up” (FIG.14B). The MRAM system 1400 has coupling configurationJ_(FM)-J_(AF1)-J_(AF2).

FIG. 14B shows the computed numerical values of switching fields(H_(SW)) (in Oe) for each of the magnetic layers 1404, for the twoground states. The H_(SW)'s are calculated using equations (1) to (3)described with respect to FIG. 13, and values J_(FM)=300 Oe, J_(AF1)=500Oe, J_(AF2)=200 Oe, and H_(C)=900 Oe for the respective parameters.

FIGS. 14C and 14D illustrate an exemplary process for shifting magneticbits in the MRAM structure 1400. A defect is observed when threeconsecutive magnetic layers have the same orientation. One ground stateis observed above a defect and the other ground state is observed belowthe defect. In the example of FIG. 14C(i), a “down-down-down” defect isillustrated. The three magnetic layers below this defect have the“down-down-up” magnetic ground state, whereas the three magnetic layersabove this defect have “up-up-down” magnetic ground state. Thus, thedefect represents a break in the order shown by a ground state.

The process is similar to that described in FIG. 13 and will not berepeated for the sake of brevity. One key difference between the MRAMsystem 500 and the MRAM system 1400 is that because of the presence bothantiferromagnetically coupled and ferromagnetically coupled pairs ofmagnetically layers, there are three adjacent magnetic layers with thesame magnetization direction whenever the defect s present in anantiferromagnetically coupled pair (see, e.g., FIG. 14C-ii and FIG.14C-iv). In some implementations, the system 1400 is also known as athree-layer-cell soliton ratchet.

In some implementations and as illustrated in FIG. 14D, for athree-layer-cell ratchet, one additionally requires a large coercivefield (H_(C)) and accordingly the propagation process requires:2H _(C) >J _(AF1) −J _(FM)>0; and2H _(C) >J _(FM) −J _(AF2)>0  (4)

In some implementations, a magnetic memory device comprises tens orhundreds of the MRAM structures described in FIGS. 5, 6, 13, and 14 thatare closely packed. One characteristic of the implementations disclosedin FIGS. 13 and 14 is that large magnetic fields are required. In someimplementations, it is challenging to apply large magnetic fields to asingle structure without affecting nearby structures in the memorydevice. In some implementations, Spin Transfer Torques are morepractical than magnetic fields because they appear at the same place aselectrical current (e.g., inside the pillars). Magnetic fields cannot bedirected as easily as electrical current, which literally follows theelectrical circuit.

In accordance to some implementations of the present disclosure,propagation of magnetic instabilities may be achieved using a spinpolarized current. In other words, instead of a magnetic field, acurrent is applied to an MRAM device and/or system. The applied currentproduces a Spin Hall Effect (SHE) that is in turn used to switch themagnetic layers of the MRAM device and/or system. In someimplementations, the propagation of magnetic instabilities (e.g.,magnetic defects) using the SHE requires the magnetic layers in the MRAMsystem and/or device to have the vortex magnetization state (e.g., thevortex magnetic ground state 700 of FIG. 7A). In some implementations,the propagation of magnetic instabilities (e.g., magnetic defects) usingthe SHE requires the exchange of the individual magnetic layers to berelatively weak so as favor the vortex magnetic state. Furthermore, thecoupling layers (e.g., non-magnetic layers) must facilitate RKKYcoupling between the magnetic layers.

FIGS. 15A to 15D illustrates application of a current to the MRAM device600, in accordance with some implementations. The current produces theSHE causing respective magnetic layers of the MRAM device 600 to switcha magnetization direction.

In some implementations, the MRAM device 600 is also known as athree-dimensional magnetic shift register. Each of the magnetic layers604 has a vortex magnetization state (e.g., the vortex magnetic groundstate 700 of FIG. 7A), and adjacent magnetic layers are separated by arespective non-magnetic layer 606. The magnetic layers 604 areantiferromagnetically coupled. Accordingly, the MRAM device of FIG.15(A) is in one of two possible magnetic ground states.

As shown in FIG. 15A and also referring to FIG. 6, the MRAM device 600includes the input terminal 622 coupled to one end (e.g., a first end)of the core 602. The current source 624 (FIG. 6) is coupled to the inputterminal 622. In some implementations, the current source 622 isconfigured to supply current imparting a Spin Hall Effect (SHE) aroundthe circumference of the core 602. The SHE contributes to amagnetization of the plurality of magnetic layers 604 in the stack 630.

In some implementations, the current source 624 is configured to supplya specific current to change a direction of magnetization of a specificone of the plurality of magnetic layers 604. In other implementations,the current source is configured to supply a specific current to changea direction of magnetization of a specific set (e.g., two or more) ofthe plurality of magnetic layers 604. The current is introduced in thecore 602 which is metallic. However, due to the fact that the magneticlayers 604 themselves are also metallic, and may possess a lowerresistivity than the core 602, a large fraction of the current may beshunted via the outer metallic magnetic layers 604. In someimplementations, the magnitude of the current depends on the thermalstability of the layers but for a typical stability of 60 kT (where k isthe Boltzmann's constant=1.38×10⁻²³ J/K, and T is the temperature inKelvin) those currents would be of the order of a few hundredmicro-Amperes (e.g., 200 μA, 300 μA, or 400 μA) taking into account theshunt current via the magnetic layers 604.

When a current is applied through the core 602, a magnetic field iscreated around the core 602. This is also known as the Ampere Laweffect. The Ampere Law Effect is distinct from the SHE. In someimplementations, depending on the material used for the core 602, thesign of the SHE can be reversed. This mostly depends on the sign ofRussell-Saunders Coupling (or the L-S coupling) in the core material.For materials with a positive Spin Hall angle, the direction of the SHEand the Ampere Law magnetic field would be the same and hence theadditional Oersted field would further help in switching the layers.Obviously in the case of a negative Spin Hall angle those effects areantagonistic. However, a rough calculation reveals that for a 400 μAcurrent through the core, an Oersted field equivalent to 400 Oe isgenerated, which is only 10% of the required spin hall switching field.In other words, one would expect the SHE effect to be the more dominantof the two effects.

In some implementations and referring to the transition from FIG. 15A toFIG. 15B, the MRAM device 600 includes a first magnetic layer 604-1 anda second magnetic layer 604-2 that is separated from the first magneticlayer 604-1 by a first non-magnetic layer 606-2 of the plurality ofnon-magnetic layers 606. The first magnetic layer has a vortexmagnetization (e.g., vortex magnetic ground state) in a first direction608 (e.g., a counterclockwise rotational direction). The second magneticlayer has a vortex magnetization in a second direction 610 (e.g., aclockwise rotational direction) that is opposite to the first direction608. The vortex magnetization of the first magnetic layer 604-1 switchesfrom the first direction 608 (e.g., counterclockwise) to the seconddirection 610 (e.g., clockwise) when the SHE imparted around thecircumference (e.g., perimeter) of the core 602 satisfies a first SHEthreshold. The vortex magnetization of the second magnetic layer 604-2switches from the second direction 610 (e.g., clockwise) to the firstdirection 608 (e.g., counterclockwise) when the SHE imparted around thecircumference (e.g., perimeter) of the core 602 satisfies a second SHEthreshold. In some implementations, the clockwise direction and thecounterclockwise direction are determined using the Right Hand Ruleconvention. In some implementations, the transition from FIG. 15A toFIG. 15B is facilitated by an injector that is configured to introduce(e.g., inject) one or more magnetic instabilities (e.g., defects) intothe MRAM device 600, which will be discussed in greater detail in FIG.24.

FIG. 15B shows a magnetic instability at adjacent magnetic layers, inaccordance with some implementations. As described previously, amagnetic instability (or a defect) is associated with two (e.g., a pairof) adjacent magnetic layers having a same magnetization direction.Here, the second magnetic layer 604-2 and the third magnetic layer 604-3are adjacent magnetic layers that are separated by the secondnon-magnetic layer 606-3. Both the second magnetic layer 604-2 and thethird magnetic layer 604-3 have vortex magnetization in the firstdirection (e.g., counterclockwise). In some implementations, a magneticdefect includes a pair of adjacent magnetic layers of the device 600both having the clockwise magnetization direction. In someimplementations, a magnetic instability in the clockwise(counterclockwise) direction is referred to as a magnetic instability ofthe first (second) sign/polarity, whereas a magnetic instability in thecounterclockwise (clockwise) direction is referred to as a magneticinstability of the second (first) sign/polarity. It is noted that thedesignation of the “first” sign and the “second” sign to thecounterclockwise and the clockwise directions is arbitrary.

FIGS. 15B to 15D illustrate the propagation the magnetic stability inthe device 600 in accordance with some implementations.

In some implementations and referring to the transition from FIG. 15B toFIG. 15C, the device 600 includes a third magnetic layer 604-3 that isseparated from the second magnetic layer 604-2 by a second non-magneticlayer 606-3. The third magnetic layer 604-3 has a vortex magnetizationin the first direction 608. In some implementations, the current source624 coupled to the input terminal 622 is configured to supply currenthaving a first magnitude I₁ 1502 that imparts a SHE around thecircumference of the core 602. The vortex magnetization of the thirdmagnetic layer 604-2 switches from the first direction 608 (e.g.,counterclockwise) to the second direction 610 (e.g., clockwise) when theSHE imparted around the circumference (e.g., perimeter) of the coresatisfies a third threshold. That is to say, the current that issupplied causes a spin current that is large enough to overcome themagnetic field (e.g., the magnetic switching field).

As depicted in FIGS. 15 and 6, the ring-shaped (or annular-shaped)magnetic layers 604 of the MRAM device 600 employ spin currents (insteadof external fields) to switch the individual layers. In someimplementations, one may boil down the expression of the energy of thevortex state to an effective field via H_(eff)=2Δ/(M_(s)V) where Δ isthe energy barrier of the vortex state, M_(s) is the magnetic moment andV is the volume of the element. The value of this effective field is thevalue of a field that wraps concentrically around the core 602 (similarto a field in the vicinity of an infinitely long wire) and that would berequired to switch the direction of the magnetic state from onerotational direction to its opposite, in essence a coercive field. Whenincluding the coupling from the top and bottom elements, one can use theexpression

$H_{SW} = {H_{eff} + \frac{J_{1}}{t} - \frac{J_{2}}{t}}$that has been derived from Equation (1), where μ_(i)=−1 and t is thethickness of the magnetic element, to estimate the value of theswitching field.

In some implementations and referring to the transition from FIG. 15C toFIG. 15D, the device 600 includes a fourth magnetic layer 604-4 that isseparated from the third magnetic layer 604-3 by a third non-magneticlayer 606-4. The fourth magnetic layer 604-4 has a vortex magnetizationin the second direction 610. In some implementations, the current source624 is configured to supply current having a second magnitude I₂ 1504that imparts a SHE around the circumference of the core 602. The vortexmagnetization of the fourth magnetic layer 604-4 switches from thesecond direction 610 to the first direction 608 when the SHE impartedaround the circumference (e.g., perimeter) of the core 602 satisfies afourth threshold.

In some implementations, each of the first, second, third, and fourththresholds is distinct. In some implementations, at least two of thefirst, second, third, and fourth thresholds have a same value.

In some implementations, the first current magnitude I₁ 1502 and thesecond current magnitude I₂ 1504 are part of a current pulse supplied bythe current source 624. In some implementations, the current pulsecomprises a triangular pulse that includes a leading edge and a trailingedge. In some implementations, the first current magnitude I₁ 1502corresponds to the peak value of the leading edge and the second currentmagnitude I₂ 1504 corresponds to a predefined value of the trailing edgeof the triangular pulse.

In some implementations, the current pulse supplied by the currentsource 624 corresponds to a current pulse with a square wave function.

In some implementations, the first SHE threshold and the second SHEthreshold are satisfied in response to one or more current pulsessupplied by the current source 624. In some implementations, each of theone or more current pulses includes a leading edge and a trailing edge,as also illustrated in FIGS. 25A and 25B.

In some implementations, the current source 624 is configured to supplya specific current to change a direction of magnetization of a specificone of the plurality of magnetic layers 604 (e.g., from a clockwisedirection to a counterclockwise direction). In some implementations, thecurrent source 624 is configured to supply a specific current to changea direction of magnetization of a specific one set of the plurality ofmagnetic layers 604.

In some implementations, the direction of the propagation of themagnetic instability (e.g., defect) is unidirectional. In the example ofFIG. 15, the magnetic instability propagates in an upward direction. Inother implementations, the magnetic instability propagatesuni-directionally in a downward direction.

FIG. 16 illustrates a cross-sectional schematic 1600 of a cylindricalMRAM device (e.g., the MRAM device 600), in accordance with someimplementations. The schematic shows cross-sectional schematic ofmagnetic layers 1604 alternating between non-magnetic layers 1606. Insome implementations, the cross-sectional schematic magnetic layers 1604correspond to the magnetic layers 604 of FIG. 6, and the cross-sectionalschematic non-magnetic layers 1606 correspond to the magnetic layers 606of FIG. 6.

The magnetic layers 1604 include a plurality of first magnetic layers(ML1) each having a thickness (e.g., height) of t_(m1) and a resistivityof ρ_(m). The magnetic layers 1604 further include a plurality of secondmagnetic layers (ML2) each having a thickness (e.g., height) of t_(m2)and a resistivity of ρ_(m). The non-magnetic layers 1606 include aplurality of first non-magnetic layers (NML1) each having a thickness(e.g., height) of t_(j1) and a resistivity of ρ_(j). The non-magneticlayers 1606 further include a plurality of second non-magnetic layers(NML2) each having a thickness (e.g., height) of t_(j2) and aresistivity of ρ_(j). The core (e.g., the core 602) has a resistivity ofρ_(c) and a width (e.g., diameter) of w₁. The width (e.g., diameter) ofthe stack including the core, the magnetic layers and the non-magneticlayers is w₂.

In some implementations, the magnetic layers 1604 and the non-magneticlayers 1606 in the stack are arranged as repeating unit cells 1602, eachunit cell having the sequence (from bottom to top) ML1-NML1-ML2-NML2.FIG. 16 also shows a table identifying relevant parameters (e.g.,resistivity, coupling, and Spin Hall angle) and representative values ofidentified materials.

FIG. 17 shows a resistivity model of the unit cell 1602 for a MRAMdevice (e.g., the MRAM device 600), in accordance with someimplementations. In some implementations, each of the magnetic layersand the non-magnetic layers may be thought of a, respectively, amagnetic resistor having a respective resistance value and anon-magnetic resistor having a respective resistance value. The core(e.g., the core 602) may be thought of as a core resistor with acorresponding core resistance value. The non-magnetic resistors and themagnetic resistors are arranged in a parallel configuration with respectto the core resistor.

In some implementations, the core (e.g. the core 602) has a lowerelectrical resistivity than a combined electrical resistivity of themagnetic layers 1604 and the non-magnetic layers 1606 in the stack 630.Accordingly, most of the current from the input terminal 622 flowsthrough the core 602. In other words, the core 602 must have higherelectrical conductivity than the combined electrical conductivity of thelayers in the stack 630.

In some implementations, the core is composed of a material that isnon-magnetic, electrically conductive and/or has a high Spin Hall angle(e.g., β-Tantalum or β-Tungsten). In some implementations, β-W is apreferred material for the core owing to its high electricalconductivity.

FIG. 18 illustrates estimations of thermal stability and switchingcurrents for a 20 nm-wide MRAM device (e.g., a ratchet structure), inaccordance with some implementations.

FIG. 19 illustrates corresponding effective fields (in Tesla) for the 20nm-wide MRAM device (e.g., ratchet structure) of FIG. 18, in accordancewith some implementations.

FIGS. 20A-20B illustrate values of RKKY coupling and Spin Hall Effect(SHE) angle and resistivity from the prior art, in accordance with someimplementations.

FIG. 21 illustrates other values of RKKY coupling and Spin Hall Effect(SHE) angle and resistivity from prior art, in accordance with someimplementations.

FIG. 22A to 22F illustrate injection and propagation of magneticinstabilities (e.g., defects) in the MRAM system 500, in accordance withsome implementations.

In some implementations and as depicted in FIG. 22, the MRAM system 500further comprises an injector 2210 that is configured to introduce(e.g., inject) one or more magnetic instabilities (e.g., defects) intothe stack 530. In some implementations, the stack 530 is also known asthe “soliton propagation layer” or the “propagation layer”, and is usedinterchangeably henceforth. The injector 510 and the propagation layer530 are adjacent to (e.g., contiguous with) each other in the MRAMsystem 500. The injector 2210 is arranged in a stack with respect to thepropagation layer 530.

In some implementations, the injector 2210 includes a single magnetic(e.g., ferromagnetic) layer. In some implementation, the injector 2210includes a plurality of magnetic layers (not shown). In someimplementations, the injector 2210 includes a height (e.g., a thickness)that is larger than a respective height (e.g., thickness) of each themagnetic layers 504 in the propagation layer 530. In someimplementations, the injector 2210 has a larger magnetic coercivity thaneach of the magnetic layers 504 in the propagation layer 530.

In the FIGS. 22A to 22F, the left half of the Figure provides aschematic of the MRAM system 500 at every step of the injection and/orpropagation operation. The steps are numbered numerally at the top ofthe schematic. The schematic includes block arrows 2202 representing adownward switching field, H_(SW)(down), and/or block arrows 2204representing an upward switching field, H_(SW)(up), for each of themagnetic layers 504. As discussed earlier with respect to FIG. 13,H_(SW)(down) refers to the field (e.g., in Oe) required to switch amagnetic layer to the down magnetization direction from the upmagnetization direction. H_(SW)(up) refers to the field required toswitch a magnetic layer to the up magnetization direction from the downmagnetization direction. The numbers inside each of the block arrows2202 and 2204 represent the magnitude of the switching fields. It isnoted here that the actual magnetization direction of the magneticlayers 504 are in fact opposite to those depicted by the block arrows2202 and 2204.

The right half of the each of the FIGS. 22A to 22F show line diagrams2240, applied external magnetic field (H_(ext)) 2242 (in units of Oe),markers 2248 that identify the magnetic layer 504 whose magnetizationdirection is switched in each step (if applicable), and a plot 2220showing variation of the applied field H_(ext) over time. Essentially,the right half of the figure provides the same information given on theleft, but in a different form. The line diagrams 2240 include arrows2244 pointing to the right (i.e., →) and/or arrows 2246 pointing to theleft (i.e., ←). The arrows 2244 pointing to the right are equivalent tothe block arrows 2202 representing H_(SW)(down). The arrows 2246pointing to the left are equivalent to the block arrows 2204representing H_(SW)(up).

In some implementations, the injection of an initial defect (e.g., afirst defect 2230-1) comprises: At step (0), a large negative externalmagnetic field (e.g., −1000 Oe) is applied to reset the MRAM system 500so that each of the magnetic layers 504 has a downward switching fieldH_(SW)(down) (i.e., up magnetization direction). From step (0) to step(1), the external field (H_(ext)) is reduced (e.g., from −1000 Oe to−500 Oe) to relax the MRAM system 500 to cause formation of anantiferromagnetic (AFM) configuration in the propagation layer 530. Fromstep (1) to step (2), the external field (H_(ext)) is further reduced(e.g., from −500 Oe to 0 Oe) and an AFM configuration in the propagationlayer 530 results.

FIG. 22A illustrates that the injector 2210 has the same H_(SW)(down)switching field direction (or the same up magnetization direction) asthe magnetic layer 504-1. Furthermore, the injector 2210 and themagnetic layer 504-1 are adjacent magnetic layers. Accordingly, a defect2230-1 (or magnetic instability) is associated with the injector 2210and the magnetic layer 504-1. In some implementations, the defect 2230-1is also known as a negative defect because the switching fields of thetwo adjacent magnetic layers are in a same (e.g., downward) direction.

FIG. 22B illustrates the first propagation cycle in accordance with someimplementations. After the AFM configuration is formed in the stack 530in FIG. 22A at step (2), an external magnetic field H_(ext) (e.g., 840Oe) is applied. In some implementations, the applied field H_(ext)(e.g., 840 Oe) is larger than the switching field H_(SW)(down) (e.g.,818 Oe) of the magnetic layer 504-1. Responsive to the external magneticfield H_(ext) (e.g., 840 Oe), the magnetic layer 504-1 switches from theup magnetization to the down magnetization, as illustrated in thetransition from (2) to (3). In other words, the switching field of themagnetic layer 504-1 switches from H_(SW)(down) 2202 to H_(SW)(up) 2204,as illustrated in the transition from (2) to (3). Thus, the first (e.g.,initial) defect 2230-1 moves (e.g., propagates) up by one layer. Thedefect 2230-1 is now associated with the magnetic layers 504-1 and504-2. The transition from (2) to (3) also shows that when the defect2230-1 propagates (e.g., upward) by one magnetic layer, the polarity ofthe defect 2230-1 switches (e.g., reverses). In some implementations,the defect 2230-1 in step (3) is also known as a positive defect becausethe switching fields of the two respective adjacent magnetic layers arein the upward (e.g., H_(SW)(up) 2204)) direction.

At step (3), H_(ext) is reduced (e.g., from 840 Oe to 500 Oe). SinceH_(ext)<H_(SW)(up)=553 Oe for the magnetic layer 504-2, the H_(ext)(e.g., 500 Oe) causes the magnetic layer 504-2 to flip from the downmagnetization direction in (3) to the up magnetization direction in (4).In other words, the switching field of the magnetic layer 504-2 switchesfrom H_(SW)(up) 2204 to H_(SW)(down) 2202 from step (3) to (4) and isshown in FIG. 22B. The defect 2230-1 moves up again by one magneticlayer and is now associated with the magnetic layers 504-2 and 504-3.The defect 2230-1 switches (e.g., changes) from the positive polarity in(3) to the negative polarity in (4).

FIG. 22C illustrates the second propagation cycle, in accordance withsome implementations. The second propagation cycle includes steps (4),(5), and (6), and is similar to the first propagation cycle as describedwith respect to FIG. 23. In each of the steps in the second propagationcycle, the defect 2230-1 moves (e.g., propagates) upward in the stack530 by one layer and the polarity of the defect 2230-1 switches betweenconsecutive steps.

FIG. 22D illustrates the third propagation cycle and the injection of apositive defect, in accordance with some implementations. In someimplementations, a new defect 2230-2 (e.g., a second defect) having apolarity that is opposite to the initial defect 2230-1 may be created(e.g., introduced) by applying a predefined external field H_(ext) tocause the injector 2210 to reverse its magnetization direction. In theexample of FIG. 22D, an external field H_(ext) of 940 Oe is applied atstep (6). Since H_(ext)>H_(SW)(down)=878 Oe for the injector 2210 andH_(ext)>H_(SW)(down)=818 Oe for the magnetic layer 504-5, the switchingfield direction of both the injector 2210 and the magnetic layer 504-5changes from the H_(SW)(down) direction 2202 to the H_(SW)(up) direction2204 in the transition from step (6) to (7). As shown in step (7), thesecond defect 2230-2 with a positive polarity is formed at the adjacentinjector layer 2210 and the magnetic layer 504-1. The MRAM system 500now includes two defects 2230-1 and 2230-2

At step (7), H_(ext)=500 Oe is applied to the MRAM system 500. SinceH_(ext)<H_(SW)(up)=553 Oe for the magnetic layer 504-6, this appliedfield causes the magnetic layer 504-6 to switch (e.g., reverse) itsmagnetization direction, as illustrated in the transition from (7) to(8). The initial defect 2230-1 moves (e.g., propagates) upward in thestack 530 by one layer and the polarity of the defect 2230-1 switchesfrom positive in (7) to negative in (8).

FIG. 22E illustrates the first propagation cycle of the second defect2230-2 (e.g., the positive defect), in accordance with someimplementations. In some implementations and instances, the seconddefect 2230-2 has a polarity (e.g., sign, or magnetization direction)that is opposite to the initial defect 2230-1. The second defect 2230-2may be propagated by applying a magnetic field with a polarity that isopposite to the magnetic field that is used to propagate the initialdefect 2230-1. In this example, a negative magnetic field (H_(ext)=−840Oe) is applied to the MRAM system 500 at step (8). Because the appliedfield of −840 Oe<H_(SW)(up)=−818 Oe for the magnetic layer 504-1, itcauses the magnetic layer 504-1 to switch (e.g., flip) its magnetizationdirection, as illustrated in the transition from (8) to (9).Accordingly, the second defect 2230-2 moves (e.g., propagates) upward inthe stack 530 by one layer and its polarity reverses (e.g., switches)from positive in (8) to negative in (9). At (9), a negative fieldH_(ext)=−500 Oe field is applied. Since −500 Oe>H_(SW)(down)=−553 Oe forthe magnetic layer 504-2, this applied field causes the magnetic layer504-2 to switch (e.g., reverse) its magnetization direction, asillustrated in the transition from (9) to (10). Thus, the second defect2230-2 moves (e.g., propagates) upward in the stack 530 by one layer andits polarity reverses (e.g., switches) from negative in (9) to positivein (10).

As further illustrated in FIG. 22E, the application of the negativemagnetic fields to the MRAM system 500 causes only the second (e.g.,positive) defect 2230-2 and not the initial defect 2230-1 to move in thestack 530.

In some implementations, the MRAM system 500 comprises multiple first(e.g., negative) defects 2230-1 and multiple second (e.g., positive)defects 2230-2. In some implementations, the applied fields H_(ext)include fields having a first (e.g., positive) polarity and fieldshaving a second (e.g., negative) polarity. In some implementations, theapplied fields H_(ext) having the first (e.g., positive) polarity causespropagation of only the first defects 2230-1 and not the second defects2230-2. In some implementations, the applied fields H_(ext) having thesecond (e.g., negative) polarity causes propagation of only the seconddefects 2230-2 and not the first defects 2230-1.

FIG. 22F illustrates the second propagation cycle of the positive defect2230-2, in accordance with some implementations. In someimplementations, the second propagation cycle of the positive defect2230-2 is similar to the first propagation cycle of the positive defect2230-2 that is described in FIG. 22E.

In some instances, and as illustrated in step (12) of FIG. 22F, thesecond defect 2230-2 is adjacent to the first defect 2230-1 in the stack530 and thus subsequent propagation of the second defect 2230-2 willcause the second defect 2230-1 to collide with the first defect 2230-1.Collision of defects leads to annihilation of defects and should beavoided for the purposes of a memory device. In some implementations, toavoid the collision of defects, one cannot fill the entire MRAMstructure 500 with defects. Accordingly, in some implementations, themaximum density of the MRAM device 500 is 67%.

In some implementations, the applied field H_(ext) is a first magneticpulse train (or magnetic pulse wave) whose shape (e.g., applied fieldwaveform) is represented by the plot 2220 in FIGS. 22A to 22F. That is,the first magnetic pulse train includes, for each of the steps (0) to(12), an applied field of a respective magnitude and an instantaneousmagnetic field transition between consecutive steps.

FIGS. 23A and 23B illustrate injection and propagation of defects in aMRAM system using alternative pulses, in accordance with someimplementations. FIG. 23A shows the injection (e.g., creation) of thefirst defect 2230-1 using alternative magnetic pulses to those describedin FIG. 22. In some implementations, the defect injection in FIG. 23A issimilar the process described in FIG. 22A albeit using a differentmagnetic pulse train (e.g., waveform). In some implementations, theapplied field H_(ext) is a second magnetic pulse train (or magneticpulse wave) that takes the shape of plot 2302 in FIGS. 23A and 23B. Thatis, the second magnetic pulse train includes a series of triangularpulses, each triangular pulse having a leading edge and a trailing edge.

In some implementations, the pulses (e.g., magnetic pulses) do not needto have a flat-top shape and/or be piecewise linear. In someimplementations, the pulses need to cross specific thresholds (e.g.,magnetic field magnitudes) to cause a switch in the magnetizationdirection of a magnetic layer.

Having described the injection and propagation of magnetic instabilities(e.g., defects) in the MRAM system 500 that includes magnetic layers 504with perpendicular magnetizations directions, we now turn to specificimplementations for the injection and propagation of magneticinstabilities (e.g., defects) for a cylindrical MRAM device (e.g., theMRAM device 600 in FIG. 6).

FIGS. 24A to 24F illustrate the cylindrical MRAM device 2400 that isconfigured to inject (e.g., create) and propagate one or more magneticinstabilities (e.g., defects) using the Spin Hall Effect (SHE), and theprocess of injecting and propagating the one or more magneticinstabilities via the SHE, in accordance with some implementations.

In some implementations, the cylindrical MRAM device 2400 is the MRAMdevice 600 with the addition of an injector 2402 that is configured toinject (e.g., create) one or more magnetic instabilities. The injector2402 comprises one or more ferromagnetic materials each having a vortexmagnetization (e.g., a vortex magnetic ground state) and an associatedmagnetization direction (e.g., clockwise or counterclockwise).

The MRAM device 2400 includes a non-magnetic and electrically conductivecylindrical core 602 (FIG. 6) that is configured to receive a current.As described above and illustrated in FIG. 24A, the MRAM device 2400 isthe MRAM device 600 with the addition of the injector 2402 (or aninjector layer). The injector 2402 surrounds the core 602 and isconfigured to introduce (e.g., create or inject) one or more magneticinstabilities (e.g., defects) into the stack 630. The stack 630 isadjacent to (e.g., contiguous, having a common surface) to the injector2402. The injector 2402 and the stack 630 are arranged so as to form avertical structure. As described earlier, the stack 630 also surroundsthe cylindrical core 602 and is configured to store information based ona respective position of the one or more magnetic instabilities withinthe magnetic layers 604. The information is stored in the form ofmagnetic bits. Magnetic bits can take a ‘0’ or ‘1’ state depending onthe magnetization direction of adjacent magnetic layers.

The stack 630 (see also FIG. 6) comprises a plurality of magnetic layers604 and a plurality of non-magnetic layers 606. Respective magneticlayers of the plurality of magnetic layers 604 are separated byrespective non-magnetic layers of the plurality of non-magnetic layers606. Each of the plurality of magnetic layers 604 has an associatedmagnetization (e.g., magnetic state) and a respective magnetizationdirection.

In some implementations, the stack 630 is also referred to as apropagation stack and/or the propagation layer. In some implementations,the stack 630 is also referred to as a ratchet structure as it allowsthe defect to propagate in only one direction (e.g., is unidirectional).

In some implementations, each of the one or more magnetic instabilities(e.g., defects) is associated with two adjacent magnetic layers having asame (e.g., vortex) magnetization direction.

In some implementations, the MRAM device 2400 further comprises an inputterminal coupled to a first end of the cylindrical core 604 (e.g., theinput terminal 622, see FIG. 6) and a current source (e.g., the currentsource 624) coupled to the input terminal. The current source isconfigured to supply current to the cylindrical core 604 by imparting aSpin Hall Effect (SHE) around the circumference of the cylindrical core604. The SHE imparted around the circumference of the core 604contributes to the magnetization of the injector 2402 and the stack 630.

In some implementations, the injector 2402 comprises a single magneticlayer.

In some implementations, the single magnetic layer of the injector 2402has a height (e.g., thickness) that is larger than respective heights ofeach of the plurality of magnetic layers 604 in the stack 630.

In some implementations, the injector 2402 comprises a plurality (e.g.,two or more) of magnetic layers (not shown).

In some implementations, the injector 2402 further includes a pluralityof non-magnetic layers, and respective magnetic layers of the pluralityof magnetic layers in the injector 2402 are separated by respectivenon-magnetic layers of the plurality of non-magnetic layers in theinjector 2402.

In some implementations, the injector 2402 has a larger magneticcoercivity than each of the plurality of magnetic layers 504 in thestack 630.

In some implementations, the injector 2402 and the stack 630 are annularin shape (e.g., ring-shaped).

In some implementations, the current source of the MRAM device 2400supplies electrical current (or electrical current pulses) to the MRAMdevice 2400 to inject and/or propagate one or more magneticinstabilities in the device. Specifically, the supplied/applied currents(or current pulses) 2404 causes switching of magnetization direction inrespective magnetic layer(s) of the MRAM device 2400. In someimplementations and described later, the current is introduced as atrain of current pulses with amplitudes/durations such as to providesufficient Spin-Hall current to exceed some predetermined currentthresholds and enable successive switching of the magnetization ofspecific layers. In some implementations, typical durations for eachpulse in the pulse train are between 1 ns and 100 ns (e.g., on the orderof 10 ns). The current amplitudes are expected to be of the order ofseveral 100 μA.

In some implementations and as illustrated in FIGS. 6 and 24A, theinjector 2402 has a vortex magnetization (e.g., magnetic ground state)with a counterclockwise (e.g., right-handed) switching fieldmagnetization H_(SW)(ccw) 2416. Each of the plurality of magnetic layers604 in the stack 630 also has vortex magnetization (e.g., a vortexmagnetic state). The plurality of magnetic layers 604 has either theH_(SW)(ccw) 2416 switching field magnetization or a clockwise (e.g.,left-handed) switching field magnetization H_(SW)(cw) 2418. It is notedhere FIG. 6 shows the actual magnetization directions of the respectivemagnetic layers 604 in the MRAM device whereas FIG. 24 shows theswitching field magnetization direction. That is to say, the actualmagnetization directions of the respective magnetic layers 604 in FIG.24 are in fact opposite to the respective switching field magnetizations(e.g., H_(SW)(ccw) 2416 and H_(SW)(cw)2418) depicted in FIG. 24.

In accordance with some implementations and referring to FIGS. 24A-24Fand 6, a method of operating a magnetic memory is performed at the MRAMdevice 2400 which includes the cylindrical core 602, the injector 2402,and the stack 630. The injector 2402 includes a first injector magneticlayer 2420 having a first (e.g., vortex) magnetization in a firstdirection. In the example of FIG. 24A, the first injector magnetic layer2420 has the counterclockwise switching field H_(SW)(ccw) 2416 andaccordingly in this instance the first direction is the clockwisedirection, since the actual magnetization direction of the injector 2402is opposite to the switching field direction, as discussed above. Inthis example the assignment of direction to the magnetic layers ispurely arbitrarily, and in other implementations, the first directionmay be the counterclockwise direction (i.e., having the clockwiseswitching field H_(SW)(cw) 2418).

The stack 630 includes a first stack magnetic layer 604-1 that isseparated from the first injector magnetic layer 2420 by a non-magneticlayer 606-1. In other words, the first stack magnetic layer 604-1 is themagnetic layer in the stack 630 that is closest to the first injectormagnetic layer 2420.

In this example, the stack 630 initially includes a first subset of themagnetic layers 604 with the first (e.g., vortex) magnetization in thefirst direction (e.g., clockwise 610 in FIG. 6) and a second subset ofthe magnetic layers 604 with the second magnetization in a seconddirection (e.g., counterclockwise 608 in FIG. 6) opposite to the firstdirection. Stated another way, the first subset of the magnetic layers604 has the counterclockwise switching field H_(SW)(ccw) 2416 and thesecond subset of the magnetic layers 604 has the clockwise switchingfield H_(SW)(cw) 2418.

The method includes supplying a sequence of currents coupled to theinput terminal 622. The input terminal 622 is in turn coupled to thefirst end of the cylindrical core 602. The sequence of currents includesa first current (e.g., the current supplied at step (0) of FIG. 24A) anda second current (e.g., the current supplied at step (1) of FIG. 24A)after the first current.

The first current causes switching (e.g., changing) of magnetizationdirection of the second subset from the second direction (e.g.,counterclockwise) to the first direction (e.g., clockwise). Accordingly,the first current causes each of the plurality of the magnetic layers604 to have the first magnetization direction (e.g., clockwise). Statedanother way, the first current causes each of the plurality of themagnetic layers 604 to have the counterclockwise switching fielddirection H_(SW)(ccw) 2416, as illustrated in the schematic of step (0)on the left of FIG. 30.

The second current (supplied at step (1) of FIG. 24A) causes switchingof magnetization direction of respective layers of the plurality ofmagnetic layers 604 the even-numbered magnetic layers 604 in thisinstance) in such that the stack has an antiferromagnetic configuration,with the first stack magnetic layer 604-1 having the first magnetizationdirection (e.g., clockwise). Thus, the first injector magnetic layer2420 and the first stack magnetic layer 604-1 are both magnetized in thefirst (e.g., clockwise) direction. In other words, the first injectormagnetic layer 2420 and the first stack magnetic layer 604-1 both have acounterclockwise switching field H_(SW)(ccw) 2416, as illustrated in theschematic of step (2) on the left of FIG. 24A. Thus, the initial (e.g.,first) defect 2414-1 is created at the first injector magnetic layer2420 and the first stack magnetic layer 604-1 which are adjacentmagnetic layers. The operation described in steps (1) and (2) should notimpact the magnetization direction of the injector 2402.

In some implementations, the first current and the second current have asame polarity. As illustrated in FIG. 24A, the first current and thesecond current have a negative polarity.

In some implementations, the first current has a larger magnitude thanthe second current.

In some implementations, each of the first magnetization and the secondmagnetization is a vortex magnetization (e.g., a vortex magnetic groundstate). The first direction is a first rotational direction of thevortex magnetization. The second direction is a second rotationaldirection of the vortex magnetization opposite to the first rotationaldirection. In some implementations, the first rotational direction is aclockwise direction and the second rotational direction is acounterclockwise direction. In other implementations, the firstrotational direction is a counterclockwise direction and the secondrotational direction is a clockwise direction.

In some implementations, the first current imparts a first SHE aroundthe circumference of the cylindrical core 602. The second currentimparts a second SHE around the circumference of the cylindrical core602. Switching of the magnetization direction of the second subset isbased at least in part on the first SHE. Switching of the magnetizationdirection of respective layers of the plurality of magnetic layers 604is based at least in part on the second SHE.

Here, the key idea is that the Spin Hall electrons must providesufficient spin torque over a long enough time to overcome thestabilizing effect of the coupling fields and the coercivity of theindividual layer. The duration and amplitude of the current pulse aredetermined from the specific requirements of the MRAM device. In someimplementations, the critical switching current (roughly equal to the1/2 probability switching at the characteristic time-scale of thedevice) can be estimated using I_(c0)=4eαM_(s)VH_(SW)/(2ℏΘ_(sh)), wheree is the charge of the electron, α is the damping factor, H_(SW) is theswitching field calculated above, and Θ_(sh) is the spin hall angle(amount of spin current generated per electron in the non-magnetic core602).

In some implementations and referring to the schematic of step (2) inFIGS. 24A and 24B, the plurality of magnetic layers in the stack 630includes a second stack magnetic layer 604-2 located between the firststack magnetic layer 604-1 and a third stack magnetic layer 604-3. Thefirst, second, and third stack magnetic layers 604-1, 604-2, and 604-3are arranged in the antiferromagnetic configuration. Supplying thesequence of currents further comprises supplying a third current (e.g.,the current supplied at step (2) in FIG. 24B) after the second current.As illustrated in the transition from step (2) to step (3) in FIG. 24B,the third current causes switching of magnetization direction of thefirst stack layer 604-1 from the first direction (e.g., clockwise) tothe second direction (e.g., counterclockwise). In order words, the thirdcurrent causes the switching fields of the first stack layer 604-1 tochange from H_(SW)(ccw) 2416 to H_(SW)(cw) 2418. As further illustratedin step (2) of FIG. 24B, when the third current is supplied, the secondstack magnetic layer 604-2 preserves (e.g., maintains) its vortexmagnetization in the second (e.g., counterclockwise) direction and thethird stack magnetic layer 604-3 preserves (e.g., maintains) its vortexmagnetization in the first direction (e.g., clockwise). Accordingly, the(third) current that is supplied is capable of switching the orientation(e.g., sign) of the defect 2414-1 without affecting the other non-defectlayers.

In some implementations, supplying the sequence of currents furthercomprises supplying a fourth current (e.g., the current supplied at step(3) in FIG. 24B) after the third current. The fourth current causesswitching of magnetization of the second stack magnetic layer 604-2 fromthe second direction (e.g., counterclockwise) to the first direction(e.g., clockwise) and the fourth magnetic layer preserves (e.g.,maintains) the first magnetization in the first direction when thefourth current is supplied.

In some implementations and instances, the fourth current has a smallermagnitude than the third current. This is illustrated in steps (2) and(3) of FIG. 24B,

In some implementations, the sequence of currents is a sequence (e.g.,train) of current pulses that includes one or more waveforms. In someimplementations, the one or more waveforms include one or more squarewaveforms illustrated by the square pulses 2412 (FIG. 30) and/or one ormore triangle waveforms as illustrated by the triangle pulse 2502 (FIGS.25A and 25B). Each of first, second, third, and fourth currents is acurrent pulse having a respective amplitude and/or duration.

In some implementations and instances, the sequence of currents is asequence (e.g., train) of current pulses. In FIGS. 24A and 24B, each ofthe first, second, third, and fourth currents is a current pulse thatcomprises a stepwise (e.g., square, rectangle) function having arespective constant amplitude over a respective predefined timeduration. The sequence of current pulses is also depicted in pulses(e.g., plots) 2412 on the bottom right of FIGS. 24A and 24B

FIGS. 25A and 25B illustrate injection and propagation of defects in acylindrical MRAM device using alternative pulses, in accordance withsome implementations. In some implementations, the pulses 2412 may nothave a flat-top shape, or to be piecewise linear. In someimplementations, the pulses 2412 may be designed to cross specificcurrent thresholds that will in turn cause switching of respectivemagnetization directions in the magnetic layers.

In some implementations and referring to FIGS. 25A and 25B, the thirdcurrent and the fourth current are part of a current pulse having aleading edge and a trailing edge (e.g., a triangular pulse 2502 in FIGS.25A and 25B). In some implementations, the third current corresponds tothe peak value of the leading edge and the fourth current corresponds toa predefined value of the trailing edge.

In some implementations, the peak value causes the stack 630 to exhibitan unstable state and the predefined value relaxes the stack 630 to astable state.

In some implementations, each of the amplitudes and/or durations of thecurrent provides a respective Spin Hall current. Each Spin Hall currentexceeds a respective predetermined current threshold and enablesswitching of magnetization of a specific magnetic layer of the pluralityof magnetic layers.

In some implementations, the MRAM device 2400 can be generalized ashaving N magnetic layers, the N magnetic layers including one injectormagnetic layer. In other words, the MRAM device 300 includes oneinjector magnetic layer and (N−1) stack magnetic layers. The methodincludes, for an i^(th) current in the sequence of currents, causingswitching of magnetization of the (i−2)^(th) magnetic layer of the Nmagnetic layers, wherein i is a positive integer from 3 to (N+2). Insome implementations, provided there is only one defect of this kindthat we are trying to propagate, the i^(th) current in the sequence ofcurrents causing switching of magnetization of the (i−2)^(th) magneticlayer of the N magnetic layers while preserving (e.g., maintaining)magnetizations in the respective directions for other magnetic layers ofthe N magnetic layers.

FIG. 24C illustrates the MRAM device 2400 with one defect (e.g., thefirst defect 2414-1) already present in the stack 630. In other words,the plurality of magnetic layers 604 in the stack 630 is arranged in anantiferromagnetic configuration except for a first pair of adjacentmagnetic layers of the plurality of magnetic layers 604. In thisinstance, the first pair of adjacent magnetic layers is formed by thesecond stack magnetic layer 604-2 and the third stack magnetic layer604-3. The first pair has magnetization in the first (e.g., clockwise)direction.

In accordance with some implementations, and as illustrated in FIG. 24C,a method of propagating information in a magnetic memory comprisessupplying a sequence of currents to the input terminal 622 at the firstend of the cylindrical core 602. The sequence of currents includes acurrent (e.g., a current with having a magnitude) that is supplied atstep (4) and another current that is supplied at step (5) (e.g., acurrent with having another magnitude). The current at step (4) causes afirst member (e.g., the third stack magnetic layer 604-3) in the firstpair to switch from the first direction (e.g., clockwise) to a seconddirection (e.g., counterclockwise) opposite to the first direction, asillustrated in the transition from (4) to (5), thereby resulting in asecond pair of adjacent stack magnetic layers of the plurality ofmagnetic layers having magnetization in the second (e.g.,counterclockwise) direction. In this instance, the second pair ofadjacent stack magnetic layers is the third stack magnetic layer 604-3and the fourth stack magnetic layer 604-4. The second pair includes thefirst member of the first pair (e.g., the third stack magnetic layer604-3).

The current that is supplied in step (5) causes a first member in thesecond pair (in this instance the fourth stack magnetic layer 604-4) toswitch from the second direction (e.g., counterclockwise) to the firstdirection (e.g., clockwise), thereby resulting in a third pair ofadjacent magnetic layers 604-4 and 604-5 of the plurality of magneticlayers having magnetization in the first direction (e.g., clockwise). Inthis instance, the third pair of adjacent magnetic layers is the fourthstack magnetic layer 604-4 and the fifth stack magnetic layer 604-5. Thethird pair includes the first member of the second pair (e.g., thefourth stack magnetic layer 604-4). The first member of the first pair(e.g., 604-3) is distinct from the first member of the second pair(e.g., 604-4).

In some implementations, the injector 2402 is configured to introducemultiple defects (e.g., magnetic instabilities) to the structure (e.g.,stack 630). In some implementations, there are two distinct types ofdefects depending on the magnetization direction (or the switching fielddirection) of the injector 2402 at the time of the injection. In someimplementations, these defects are identified has a positive (“+”)defect or a negative (“−”) defect. In some implementations, defects inthe structure alternate between the “+” and “−” signs so we can refer tothem as “defects” since the sign of each be deduced from the previousone

In some implementations, a new defect (e.g., a second defect 2414-2) maybe introduced into the MRAM device 2400 while the first defect isalready present in the stack 630. As depicted in FIG. 24D, the newdefect 2414-2 is injected by supplying a fifth current (at step (6) inFIG. 24D) after the fourth current (at step (5)) in the sequence ofcurrents. The fifth current causes switching of magnetization directionof the first injector magnetic layer 2420 from the first (e.g.,clockwise) direction to the second (e.g., counterclockwise) direction,as illustrated in the transition from (6) to (7) in FIG. 24D. Thus, boththe first injector magnetic layer 2420 and the first stack magneticlayer 604-1 are now magnetized in the second (e.g., counterclockwise)direction. In other words, the first injector magnetic layer 2420 andthe first stack magnetic layer 604-1 both have the clockwise switchingfields H_(SW)(cw) 2418. In some implementations, the second defect2412-1 that is introduced has a sign (or polarity) that is opposite tothe sign of the first defect 2412-1 when the first defect 2412-1 wasintroduced.

In accordance with some implementations, defects with different signs(e.g., “+” and “−”) can be propagated in the stack 630. In someimplementations, the first current and the second current, at steps (0)and (1) in FIG. 24A, are part of a first current pulse having a firstpolarity (e.g., a negative polarity). The magnetic layers furthercomprise a fourth pair of adjacent magnetic layers having magnetizationin the second (e.g., counterclockwise) direction. The method furthercomprises supplying a second current pulse having a second polarity(e.g., a positive polarity) opposite to the first polarity. The secondcurrent pulse includes a third current. The third current causes a firstmember in the fourth pair of adjacent magnetic layers to switch from thesecond direction to the first direction, thereby resulting in a fifthpair of adjacent magnetic layers of the plurality of magnetic layershaving magnetization in the first direction, wherein the fifth pairincludes the first member of the fourth pair; and the fourth currentcauses a first member in the fifth pair of adjacent magnetic layers toswitch from the first direction to the second direction, therebyresulting in a fifth pair of adjacent magnetic layers of the pluralityof magnetic layers having magnetization in the second direction. Thefifth pair includes the first member of the fourth pair, and the firstmember of the fourth pair is distinct from the first member of the fifthpair.

In some implementations, the stack 630 includes more than one pair ofadjacent magnetic layers having the first sign and more than one pair ofadjacent magnetic layers having the second sign. In other words, thefirst pair is one of a plurality of first pairs and the fourth pair isone of a plurality of fourth pairs. In some implementations, the methodfurther comprises: responsive to the first current, causing each of thefirst members in the plurality of first pairs of adjacent magneticlayers to switch from the first direction to the second direction;responsive to the second current, causing each of the first members inthe second pairs of adjacent magnetic layers to switch from the seconddirection to the first direction opposite to the first direction;responsive to the third current, causing each of the first members inthe plurality of fourth pairs of adjacent magnetic layers to switch fromthe second direction to the first direction; and responsive to thefourth current, causing each of the first members in the plurality offifth pairs of adjacent magnetic layers to switch from the seconddirection to the first direction.

Although some of various drawings illustrate a number of logical stagesin a particular order, stages that are not order-dependent may bereordered and other stages may be combined or broken out. While somereordering or other groupings are specifically mentioned, others will beobvious to those of ordinary skill in the art, so the ordering andgroupings presented herein are not an exhaustive list of alternatives.Moreover, it should be recognized that the stages could be implementedin hardware, firmware, software or any combination thereof.

It will also be understood that, although the terms first, second, etc.are, in some instances, used herein to describe various elements, theseelements should not be limited by these terms. These terms are only usedto distinguish one element from another. For example, a first MRAMdevice could be termed a second MRAM device, and, similarly, a secondMRAM device could be termed a first MRAM device, without departing fromthe scope of the various described implementations. The first MRAMdevice and the second electronic device are both MRAM devices, but theyare not the same type of MRAM device.

The terminology used in the description of the various describedimplementations herein is for the purpose of describing particularimplementations only and is not intended to be limiting. As used in thedescription of the various described implementations and the appendedclaims, the singular forms “a”, “an” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will also be understood that the term “and/or” as usedherein refers to and encompasses any and all possible combinations ofone or more of the associated listed items. It will be furtherunderstood that the terms “includes,” “including,” “comprises,” and/or“comprising,” when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

As used herein, the term “if” is, optionally, construed to mean “when”or “upon” or “in response to determining” or “in response to detecting”or “in accordance with a determination that,” depending on the context.Similarly, the phrase “if it is determined” or “if [a stated conditionor event] is detected” is, optionally, construed to mean “upondetermining” or “in response to determining” or “upon detecting [thestated condition or event]” or “in response to detecting [the statedcondition or event]” or “in accordance with a determination that [astated condition or event] is detected,” depending on the context.

The foregoing description, for purpose of explanation, has beendescribed with reference to specific implementations. However, theillustrative discussions above are not intended to be exhaustive or tolimit the scope of the claims to the precise forms disclosed. Manymodifications and variations are possible in view of the aboveteachings. The implementations were chosen in order to best explain theprinciples underlying the claims and their practical applications, tothereby enable others skilled in the art to best use the implementationswith various modifications as are suited to the particular usescontemplated.

What is claimed is:
 1. A magnetic memory device comprising: anon-magnetic cylindrical core configured to receive a current; a firstportion surrounding the cylindrical core, the first portion configuredto introduce one or more magnetic instabilities into a second portion,the second portion adjacent to the first portion and arranged in a stackwith respect to the first portion; and the second portion alsosurrounding the cylindrical core and configured to store informationbased on a respective position of the one or more magneticinstabilities, wherein: the second portion comprises a first pluralityof magnetic layers and a first plurality of non-magnetic layers; andrespective magnetic layers of the first plurality of magnetic layers areseparated by respective non-magnetic layers of the first plurality ofnon-magnetic layers.
 2. The device of claim 1, wherein each of the oneor more magnetic instabilities is associated with two adjacent magneticlayers having a same magnetization direction.
 3. The device of claim 1,further comprising: an input terminal coupled to a first end of thecylindrical core; and a current source, coupled to the input terminal,the current source configured to supply current to the cylindrical coreby imparting a Spin Hall Effect (SHE) around a circumference of thecylindrical core, wherein the SHE imparted around a circumference of thecylindrical core contributes to magnetization of the first portion andthe second portion.
 4. The device of claim 3, further comprising anoutput terminal coupled to a second end of the cylindrical core oppositeto the first end, the output terminal being configured to provide acurrent readout to a third portion of the magnetic memory device.
 5. Thedevice of claim 4, wherein the third portion is coaxial with thecylindrical core and surrounds a region of the second portion, andwherein the third portion includes: a concentric spacer layer thatsurrounds at least one magnetic layer of the first plurality of magneticlayers; a ferromagnetic layer surrounding the concentric spacer layer;and a third terminal connected to the ferromagnetic layer and configuredto close a readout circuit with the output terminal.
 6. The device ofclaim 4, wherein the third portion is a first one of a plurality ofthird portions, each of the plurality of third portions surrounding arespective region of the second portion.
 7. The device of claim 5,wherein the spacer layer is composed of a dielectric material.
 8. Thedevice of claim 1, wherein the first portion comprises a single magneticlayer.
 9. The device of claim 1, wherein the first portion comprises asecond plurality of magnetic layers.
 10. The device of claim 9, whereinthe first portion further includes a second plurality of non-magneticlayers; and respective magnetic layers of the second plurality ofmagnetic layers are separated by respective non-magnetic layers of thesecond plurality of non-magnetic layers.
 11. A method of operating amagnetic memory, comprising: at a magnetic memory device including: acylindrical core; a first portion surrounding the cylindrical core, thefirst portion including a first magnetic layer having a firstmagnetization in a first direction; and a second portion adjacent to thefirst portion and arranged in a stack with respect to the first portion,wherein: the second portion includes a plurality of magnetic layers anda plurality of non-magnetic layers; the plurality of magnetic layersincludes a second magnetic layer that is separated from the firstmagnetic layer by a non-magnetic layer; the plurality of magnetic layersincludes a first subset having the first magnetization in the firstdirection and a second subset having a second magnetization in a seconddirection opposite to the first direction; and respective magneticlayers of the plurality of magnetic layers are separated by respectivenon-magnetic layers of the plurality of non-magnetic layers; and themethod including: supplying a sequence of currents to an input terminalat a first end of the cylindrical core, the sequence of currentsincluding a first current and a second current after the first current,wherein: the first current causes switching of magnetization directionof the second subset from the second direction to the first direction;and the second current causes switching of magnetization direction ofrespective layers of the plurality of magnetic layers such that thesecond portion has an antiferromagnetic configuration with the secondmagnetic layer having the first direction.
 12. The method of claim 11,wherein the first current has a larger magnitude than the secondcurrent.
 13. The method of claim 11, wherein: each of the firstmagnetization and the second magnetization is a vortex magnetization;the first direction is a first rotational direction of the vortexmagnetization; and the second direction is a second rotational directionof the vortex magnetization opposite to the first rotational direction.14. The method of claim 11, wherein: the first current imparts a firstSpin Hall Effect (SHE) around a circumference of the cylindrical core;the second current imparts a second SHE around the circumference of thecylindrical core; switching of the magnetization direction of the secondsubset is based at least in part on the first SHE; and switching of themagnetization direction of the respective layers of the plurality ofmagnetic layers is based at least in part on the second SHE.
 15. Themethod of claim 11, wherein: the plurality of magnetic layers includes athird magnetic layer between the second magnetic layer and a fourthmagnetic layer; the second, third, and fourth magnetic layers arearranged in the antiferromagnetic configuration; and supplying thesequence of currents further comprises supplying a third current afterthe second current, wherein: the third current causes switching ofmagnetization direction of the second magnetic layer from the firstdirection to the second direction; the third magnetic layer preservesthe second magnetization in the second direction when the third currentis supplied; and the fourth magnetic layer preserves the firstmagnetization in the first direction when the third current is supplied.16. The method of claim 15, wherein supplying the sequence of currentsfurther comprises supplying a fourth current after the third current,wherein the fourth current causes switching of magnetization of thethird magnetic layer from the second direction to the first directionand the fourth magnetic layer preserves the first magnetization in thefirst direction when the fourth current is supplied.
 17. The method ofclaim 16, wherein the sequence of currents is a sequence of currentpulses; each of the first, second, third, and fourth currents is acurrent pulse having a respective amplitude and/or duration.
 18. Themethod of claim 17, wherein: each of the amplitudes and/or durationsprovides a respective Spin Hall current; each Spin Hall current exceedsa respective predetermined current threshold and enables switching ofmagnetization of a specific magnetic layer of the plurality of magneticlayers.
 19. The method of claim 16, wherein supplying the sequence ofcurrents further comprises supplying a fifth current after the fourthcurrent, wherein the fifth current causes switching of magnetizationdirection of the first magnetic layer from the first direction to thesecond direction, thereby resulting in both the first magnetic layer andthe second magnetic layer to be magnetized in the second direction. 20.The method of claim 16, wherein the third current and the fourth currentare part of a current pulse having a leading edge and a trailing edge,the third current corresponds to a peak value of the leading edge andthe fourth current corresponds to a predefined value of the trailingedge.